⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL109080 | 0.67 | — | — | |
| Carbon Dioxide SCHEMBL28097670 | 0.67 | — | — | |
| SCHEMBL4020 | 0.67 | — | — | |
| SCHEMBL15006 | 0.67 | — | — | |
| SCHEMBL6245666 | 0.67 | — | — | |
| SCHEMBL136388 | 0.67 | — | — | |
| SCHEMBL29230 | 0.67 | — | — | |
| SCHEMBL21669 | 0.67 | — | — | |
| SCHEMBL10805026 | 0.67 | — | — | |
| SCHEMBL7183508 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-104789949-A | Compounding method of epoxy resin solution with autocatalysis chemical copper plating activity and chemical copper plating method | UNIV ELECTRONIC SCIENCE & TECH | 2015-07-22 | — | — | CN | claimed |
| CN-116705421-B | Silver composite conductive particles and preparation method and application thereof | 无锡松煜科技有限公司 | 2023-10-20 | — | — | CN | disclosed |
| CN-116705421-A | Silver composite conductive particles and preparation method and application thereof | 无锡松煜科技有限公司 | 2023-09-05 | — | — | CN | disclosed |
| CN-107602388-B | Method for preparing methyl glycolate and by-producing halogenated alkane | 沈阳化工大学 | 2020-10-30 | — | — | CN | disclosed |
| CN-107337602-B | Method for preparing methyl glycolate and by-producing methyl methoxyacetate | 沈阳化工大学 | 2020-04-28 | — | — | CN | disclosed |
| CN-109794285-A | A kind of catalyst and the preparation method and application thereof preparing hydroxyacetic acid for formaldehyde carbonylation | 陕西延长石油（集团）有限责任公司 | 2019-05-24 | — | — | CN | disclosed |
| CN-104789949-B | The collocation method of self-catalysis electroless copper epoxy resin solution and electroless copper plating method | 电子科技大学 | 2017-03-01 | — | — | CN | disclosed |
| CN-104789949-A | Compounding method of epoxy resin solution with autocatalysis chemical copper plating activity and chemical copper plating method | UNIV ELECTRONIC SCIENCE & TECH | 2015-07-22 | — | — | CN | disclosed |
| CN-1714929-B | Activated ignition promoters for metal catalyzed reactions | ROHM & HAAS | 2010-05-05 | — | — | CN | disclosed |
| CN-1714929-A | Activated ignition promoters for metal catalyzed reactions | ROHM & HAAS (US) | 2006-01-04 | — | — | CN | disclosed |
| CN-1177790-C | Method for producing 2,4,5-trialkyl-benzaldehyde | 株式会社日本触媒 | 2004-12-01 | — | — | CN | disclosed |
| CN-1345715-A | Method for producing 2,4,5-trialkyl-benzaldehyde | NIPPON CATALYTIC CHEM IND (JP) | 2002-04-24 | — | — | CN | disclosed |
| US-5733430-A | Gas diffusion electrode and electrolytic method using it | PERMELEC ELECTRODE LTD. (JP) | 1998-03-31 | — | — | US | disclosed |