SCHEMBL873211

SCHEMBL873211

CCCOCCC(C)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10885467 0.89 HSD17B10 (0.43)
SCHEMBL10881138 0.89 HSD17B10 (0.43)
SCHEMBL10887459 0.89 HSD17B10 (0.43)
SCHEMBL620600 0.89 HSD17B10 (0.43)
SCHEMBL10891930 0.89 HSD17B10 (0.43)
SCHEMBL8016291 0.85 HSD17B10 (0.56)
SCHEMBL4113825 0.85 TSHR (0.52)
SCHEMBL12842087 0.85 TSHR (0.52)
1,3-Butanediol SCHEMBL873212 0.85 HSD17B10 (0.56)
SCHEMBL8016296 0.85 HSD17B10 (0.56)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3961676-B1 ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2025-01-22 EP disclosed
EP-3702387-B1 PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR ETCHING GLASS SUBSTRATE TOKYO OHKA KOGYO CO LTD (JP) 2023-05-10 EP disclosed
EP-3961676-A1 ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2022-03-02 EP disclosed
CN-111624852-A Photosensitive resin composition and method for etching glass substrate 东京应化工业株式会社 2020-09-04 CN disclosed
EP-3702387-A1 PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR ETCHING GLASS SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2020-09-02 EP disclosed
EP-1379594-B1 CORROSION-RESISTANT COATING COMPOSITION CABOT CORP (US) 2019-06-26 EP disclosed
US-9358191-B2 Deodorant composition TAKASAGO INTERNATIONAL CORPORATION (JP) 2016-06-07 US disclosed
US-8961946-B2 Hair processing agent and method for permanent waving hair SHOWA DENKO K.K. (JP) 2015-02-24 US disclosed
US-20140271522-A1 DEODORANT COMPOSITION TAKASAGO INTERNATIONAL CORPORATION (JP) 2014-09-18 US disclosed
US-8778320-B2 Deodorant composition TAKASAGO INTERNATIONAL CORPORATION (JP) 2014-07-15 US disclosed
US-20090324831-A1 CURABLE RESIN COMPOSITION AND PROCESS FOR PRODUCING CURED COATING USING THE SAME DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2009-12-31 US disclosed
EP-2048196-A1 CURABLE RESIN COMPOSITION AND METHOD FOR FORMING CURED COATING FILM Daicel Chemical Industries, Ltd. (JP) 2009-04-15 EP disclosed
US-20090087401-A1 DEODORANT COMPOSITION TAKASAGO INTERNATIONAL CORPORATION (JP) 2009-04-02 US disclosed
US-7462654-B2 Corrosion-resistant coating composition CABOT CORPORATION (US) 2008-12-09 US disclosed
US-20080085251-A1 even at a neutral to weakly acidic pH; a lactone or lactam having a mercapto group; with thioglycolic acid, thiolactic acid, cysteine, acetylcysteine, cysteamine, acylcysteamine; RESONAC CORPORATION (JP) 2008-04-10 US disclosed
US-20060165622-A1 Deodorant composition TAKASAGO INTERNATIONAL CORPORATION (JP) 2006-07-27 US disclosed
CN-1670628-A Resist composition DAICEL CHEM (JP) 2005-09-21 CN disclosed
EP-1561476-A1 DEODORANT COMPOSITION Takasago International Corporation (JP) 2005-08-10 EP disclosed
EP-0859786-A1 PEPTIDE DERIVATIVES OF DOLASTATIN 15 AND THEIR USE BASF AKTIENGESELLSCHAFT (DE) 1998-08-26 EP disclosed
WO-1997017364-A1 PEPTIDE DERIVATIVES OF DOLASTATIN 15 AND THEIR USE BASF AKTIENGESELLSCHAFT (DE) 1997-05-15 WO disclosed