SCHEMBL8763515

SCHEMBL8763515

[CH2]CCNCCNCC[CH2]

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.38
TDP1 Q9NUW8 2/20 0.38
CA12 O43570 2/20 0.38
CA6 P23280 2/20 0.38
CA7 P43166 2/20 0.38
CA9 Q16790 2/20 0.38
CA14 Q9ULX7 2/20 0.38
CA5B Q9Y2D0 2/20 0.38
CA1 P00915 1/20 0.38
CA2 P00918 1/20 0.38
CA3 P07451 1/20 0.38
ALOX15 P16050 1/20 0.38
CA4 P22748 1/20 0.38
CA5A P35218 1/20 0.38
ALDH1A1 P00352 1/20 0.38
TP53 P04637 1/20 0.38
KDM4E B2RXH2 1/20 0.35
CASP2 P42575 1/20 0.33
MEN1 O00255 1/20 0.31
RECQL P46063 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3483661 0.95
SCHEMBL1229906 0.89
SCHEMBL9487092 0.84 CA12 (0.47) LMNATDP1CA12CA6CA7
SCHEMBL56789 0.83 CA12 (0.69) LMNATDP1CA12CA6CA7
SCHEMBL9392174 0.83
SCHEMBL25318000 0.83
SCHEMBL10364521 0.83
SCHEMBL10838909 0.81 CYP1A2 (0.42) LMNACA12CA6CA7CA9
SCHEMBL4934708 0.81
SCHEMBL3642431 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3596151-B1 HARDENER FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS SIKA TECH AG (CH) 2021-04-28 EP claimed
EP-3416997-B1 HARDENER FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS SIKA TECH AG (CH) 2020-09-23 EP claimed
EP-3131992-B1 FAST CURING MIGRATION-FREE COMPOSITION BASED ON POLYMERS CONTAINING SILANE GROUPS SIKA TECH AG (CH) 2020-06-17 EP claimed
EP-3416997-A1 CURING AGENT FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS Sika Technology AG (CH) 2018-12-26 EP claimed
EP-3375803-A1 HARDENER FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS SIKA TECHNOLOGY AG (CH) 2018-09-19 EP claimed
WO-2017140687-A1 CURING AGENT FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS SIKA TECHNOLOGY AG (CH) 2017-08-24 WO claimed
EP-3205682-A1 HARDENER FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS Sika Technology AG (CH) 2017-08-16 EP claimed
EP-3131992-A1 RAPID-CURING, MIGRATION-FREE COMPOSITION BASED ON POLYMERS CONTAINING SILANE GROUPS Sika Technology AG (CH) 2017-02-22 EP claimed
WO-2015158860-A1 RAPID-CURING, MIGRATION-FREE COMPOSITION BASED ON POLYMERS CONTAINING SILANE GROUPS SIKA TECHNOLOGY AG (CH) 2015-10-22 WO claimed
EP-0250363-B1 TRIAZINE DERIVATIVES OF PIPERIDINYLAMIDINES CIBA-GEIGY AG (CH) 1990-11-28 EP claimed
US-4843159-A STABILIZERS FOR POLYMERS CIBA-GEIGY CORPORATION (US) 1989-06-27 US claimed
EP-0250363-A2 Triazine derivatives of piperidinylamidines CIBA-GEIGY AG (CH) 1987-12-23 EP claimed
EP-3596151-B1 HARDENER FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS SIKA TECH AG (CH) 2021-04-28 EP disclosed
EP-3596150-B1 METHOD FOR THE PREPARATION OF A CROSS-LINKER FOR LOW EMISSION EPOXY RESIN COMPOSITIONS SIKA TECH AG (CH) 2021-04-07 EP disclosed
EP-3416997-B1 HARDENER FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS SIKA TECH AG (CH) 2020-09-23 EP disclosed
EP-3131992-B1 FAST CURING MIGRATION-FREE COMPOSITION BASED ON POLYMERS CONTAINING SILANE GROUPS SIKA TECH AG (CH) 2020-06-17 EP disclosed
EP-0250363-B1 TRIAZINE DERIVATIVES OF PIPERIDINYLAMIDINES CIBA-GEIGY AG (CH) 1990-11-28 EP disclosed
US-4843159-A STABILIZERS FOR POLYMERS CIBA-GEIGY CORPORATION (US) 1989-06-27 US disclosed
EP-0302020-A2 Process for the preparation of 2,2,6,6-tetramethyl-4-piperidyl-amines CIBA-GEIGY AG (CH) 1989-02-01 EP disclosed
EP-0250363-A2 Triazine derivatives of piperidinylamidines CIBA-GEIGY AG (CH) 1987-12-23 EP disclosed