SCHEMBL8778711

SCHEMBL8778711

CC1CCN(c2ccncc2)CC1.FB(F)F

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CHKA P35790 1/20 0.52
USP2 O75604 3/20 0.47
ADRB2 P07550 1/20 0.47
NCF1 P14598 1/20 0.47
PLD1 Q13393 1/20 0.47
TSHR P16473 5/20 0.43
MEN1 O00255 3/20 0.43
KMT2A Q03164 3/20 0.43
PKM P14618 1/20 0.43
MAPT P10636 2/20 0.43
SMN1; SMN2 Q16637 2/20 0.43
CYP2C9 P11712 2/20 0.43
GAA P10253 2/20 0.43
NPC1 O15118 1/20 0.43
RAB9A P51151 1/20 0.43
LMNA P02545 1/20 0.43
TP53 P04637 1/20 0.43
HTT P42858 1/20 0.43
NPSR1 Q6W5P4 1/20 0.43
KDM1A O60341 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL48910 0.93 CHKA (0.59) CHKAUSP2ADRB2NCF1PLD1
Hydrochloric Acid SCHEMBL8879338 0.91 CHKA (0.57) CHKAUSP2ADRB2NCF1PLD1
SCHEMBL6667369 0.81 CHKA (0.50) CHKAUSP2ADRB2NCF1PLD1
SCHEMBL19859364 0.79 CHKA (0.44) CHKAUSP2ADRB2NCF1PLD1
SCHEMBL4711666 0.75 CHKA (0.61) CHKAUSP2ADRB2NCF1PLD1
SCHEMBL8778807 0.75 KMT2A (0.44) USP2MEN1KMT2AMAPTSMN1; SMN2
SCHEMBL28112415 0.73 CHKA (0.80) CHKAADRB2NCF1PLD1TSHR
SCHEMBL206718 0.73 CHKA (0.59) CHKAADRB2NCF1PLD1TSHR
SCHEMBL4712014 0.73 CHKA (0.59) CHKAADRB2NCF1PLD1TSHR
SCHEMBL4703601 0.73 CHKA (0.59) CHKAADRB2NCF1PLD1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0626948-B1 NEW CURING AGENTS/ACCELERATORS FOR EPOXY RESINS, CURABLE COMPOSITIONS AND PROCESSES REILLY IND INC (US) 1997-11-12 EP claimed
US-5420223-A Dimethylaminopyridine salts and epoxy resins for coatings REILLY INDUSTRIES, INC. (US) 1995-05-30 US claimed
EP-0626948-A1 NEW CURING AGENTS/ACCELERATORS FOR EPOXY RESINS, CURABLE COMPOSITIONS AND PROCESSES REILLY INDUSTRIES, INC. (US) 1994-12-07 EP claimed
WO-1993015054-A1 NEW CURING AGENTS/ACCELERATORS FOR EPOXY RESINS, CURABLE COMPOSITIONS AND PROCESSES REILLY INDUSTRIES, INC. (US) 1993-08-05 WO claimed
EP-0626948-B1 NEW CURING AGENTS/ACCELERATORS FOR EPOXY RESINS, CURABLE COMPOSITIONS AND PROCESSES REILLY IND INC (US) 1997-11-12 EP disclosed
US-5420223-A Dimethylaminopyridine salts and epoxy resins for coatings REILLY INDUSTRIES, INC. (US) 1995-05-30 US disclosed