SCHEMBL877906

SCHEMBL877906

C[SiH2]C(C)[SiH2]C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2458744 0.71
SCHEMBL30726092 0.63
SCHEMBL11472623 0.63
SCHEMBL28428656 0.63
SCHEMBL31248583 0.63
SCHEMBL5072584 0.63
SCHEMBL9187387 0.63
SCHEMBL5420203 0.59
SCHEMBL9780160 0.56
SCHEMBL7711925 0.56

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2087146-A1 MULTILAYERED COATINGS FOR USE ON ELECTRONIC DEVICES OR OTHER ARTICLES The Trustees of Princeton University (US) 2009-08-12 EP claimed
WO-2008063266-A1 MULTILAYERED COATINGS FOR USE ON ELECTRONIC DEVICES OR OTHER ARTICLES THE TRUSTEES OF PRINCETON UNIVERSITY (US) 2008-05-29 WO claimed
US-6936309-B2 Hardness improvement of silicon carboxy films APPLIED MATERIALS, INC. (US) 2005-08-30 US claimed
WO-2005078155-A1 ULTRA LOW DIELECTRIC MATERIALS BASED ON HYBRID SYSTEM OF LINEAR SILICON PRECURSOR AND ORGANIC POROGEN APPLIED MATERIALS, INC. (US) 2005-08-25 WO claimed
EP-1456434-A1 A METHOD OF DEPOSITING DIELECTRIC MATERIALS IN DAMASCENE APPLICATIONS Applied Materials, Inc. (US) 2004-09-15 EP claimed
WO-2004070788-A2 METHOD FOR DEPOSITING A LOW DIELECTRIC CONSTANT FILM APPLIED MATERIALS INC. (US) 2004-08-19 WO claimed
WO-2004063422-A2 METHOD FOR CURING LOW DIELECTRIC CONSTANT FILM USING DIRECT CURRENT BIAS APPLIED MATERIALS, INC. (US) 2004-07-29 WO claimed
WO-2003052162-A1 A METHOD OF DEPOSITING DIELECTRIC MATERIALS IN DAMASCENE APPLICATIONS APPLIED MATERIALS, INC. (US) 2003-06-26 WO claimed
US-5744196-A Low temperature deposition of silicon dioxide using organosilanes AIR PRODUCTS AND CHEMICALS, INC. (US) 1998-04-28 US claimed
EP-0721019-A2 Low temperature deposition of silicon dioxide using organosilanes AIR PRODUCTS AND CHEMICALS, INC. (US) 1996-07-10 EP claimed
EP-3212696-A1 PROTECTIVE COATING SYSTEM FOR PLASTIC SUBSTRATE PPG Industries Ohio, Inc. (US) 2017-09-06 EP disclosed
EP-3055139-A1 PLASMA TREATMENT OF FLEXOGRAPHIC PRINTING SURFACE 3M Innovative Properties Company (US) 2016-08-17 EP disclosed
WO-2016069807-A1 PROTECTIVE COATING SYSTEM FOR PLASTIC SUBSTRATE PPG INDUSTRIES OHIO, INC. (US) 2016-05-06 WO disclosed
EP-2157341-B1 Cross purge valve and container assembly AIR PROD & CHEM (US) 2013-10-09 EP disclosed
EP-2619814-A2 PERMEATION BARRIER FOR ENCAPSULATION OF DEVICES AND SUBSTRATES Universal Display Corporation (US) 2013-07-31 EP disclosed
EP-1055012-A2 PLASMA PROCESSES FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS Applied Materials, Inc. (US) 2000-11-29 EP disclosed
WO-2000024050-A1 CVD NANOPOROUS SILICA LOW DIELECTRIC CONSTANT FILMS APPLIED MATERIALS, INC. (US) 2000-04-27 WO disclosed
WO-1999041423-A2 PLASMA PROCESSES FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS APPLIED MATERIALS, INC. (US) 1999-08-19 WO disclosed
US-5744196-A Low temperature deposition of silicon dioxide using organosilanes AIR PRODUCTS AND CHEMICALS, INC. (US) 1998-04-28 US disclosed
EP-0721019-A2 Low temperature deposition of silicon dioxide using organosilanes AIR PRODUCTS AND CHEMICALS, INC. (US) 1996-07-10 EP disclosed