SCHEMBL8846286

SCHEMBL8846286

C[SiH](C)O[SiH2]O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Methane SCHEMBL8084960 0.96
SCHEMBL9388440 0.74
SCHEMBL14538989 0.69
SCHEMBL9706874 0.67
SCHEMBL15424335 0.65
SCHEMBL14984377 0.65
SCHEMBL13250688 0.65
SCHEMBL152002 0.64
SCHEMBL16382435 0.64
SCHEMBL8081152 0.62

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024115652-A1 FORMULATION FOR APPLYING TO VEGETATION OKIPA LTD (GB) 2024-06-06 WO claimed
EP-3960899-A1 ANODIZED LAYERS RESISTANT TO ACID AND ALKALI Ossidazione Anodica S.r.l. (IT) 2022-03-02 EP claimed
US-20180275548-A1 INK COMPOSITION WITH PIGMENT PARTICLES HAVING A HYDROPHOBIC SURFACE HP INDIGO B.V. (NL) 2018-09-27 US claimed
EP-3237555-A1 INK COMPOSITION WITH PIGMENT PARTICLES HAVING A HYDROPHOBIC SURFACE Hewlett-Packard Indigo B.V. (NL) 2017-11-01 EP claimed
CN-106520059-A Two-component low-hardness high-elasticity low-migration room temperature curing organosilicone electronic-pouring sealant and preparation method thereof 烟台德邦科技有限公司 2017-03-22 CN claimed
WO-2016101987-A1 INK COMPOSITION WITH PIGMENT PARTICLES HAVING A HYDROPHOBIC SURFACE HEWLETT-PACKARD INDIGO B.V. (NL) 2016-06-30 WO claimed
US-20130129980-A1 PROCESS FOR SCRATCH- AND ABRASION-RESISTANT COATING AND PHYSICAL MATTING OF PLASTICS SUBSTRATES, MORE PARTICULARLY POLYMETHYL METHACRYLATE, WITH NANOCOMPOSITE COATING MATERIAL EVONIK ROEHM GMBH (DE) 2013-05-23 US claimed
WO-2024115652-A1 FORMULATION FOR APPLYING TO VEGETATION OKIPA LTD (GB) 2024-06-06 WO disclosed
WO-2023146172-A1 HIGH-LUMINANCE SILICONE RESIN COMPOSITION AND CURED PRODUCT THEREOF 주식회사 한솔케미칼 2023-08-03 WO disclosed
WO-2023033468-A1 CURABLE SILICONE COMPOSITION CAPABLE OF HAVING DOME SHAPE, AND CURED PRODUCT THEREOF 주식회사 한솔케미칼 2023-03-09 WO disclosed
WO-2021161990-A1 ADHESIVE TAPE 積水化学工業株式会社 2021-08-19 WO disclosed
WO-2021106997-A1 DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE 積水化学工業株式会社 2021-06-03 WO disclosed
US-10927227-B2 Flexible foam with halogen-free flame retardant COVESTRO DEUTSCHLAND AG (DE) 2021-02-23 US disclosed
US-8946357-B2 Organosilicon compound, thermosetting resin composition containing the organosilicon compound, hardening resin and encapsulation material for optical semiconductor JNC CORPORATION (JP) 2015-02-03 US disclosed
US-20130129980-A1 PROCESS FOR SCRATCH- AND ABRASION-RESISTANT COATING AND PHYSICAL MATTING OF PLASTICS SUBSTRATES, MORE PARTICULARLY POLYMETHYL METHACRYLATE, WITH NANOCOMPOSITE COATING MATERIAL EVONIK ROEHM GMBH (DE) 2013-05-23 US disclosed
US-20130104756-A1 DAMPENING FLUID FOR DIGITAL LITHOGRAPHIC PRINTING XEROX CORPORATION (US) 2013-05-02 US disclosed
US-20130096249-A1 NEW ORGANOSILICON COMPOUND, THERMOSETTING RESIN COMPOSITION CONTAINING THE ORGANOSILICON COMPOUND, HARDENING RESIN AND ENCAPSULATION MATERIAL FOR OPTICAL SEMICONDUCTOR JNC CORPORATION (JP) 2013-04-18 US disclosed
EP-0628611-B1 An electrodeposition paint composition NIPPON PAINT CO LTD (JP) 1997-08-27 EP disclosed
US-5441995-A Forms film with reduced number of craters and indentations; automobile coatings NIPPON PAINT CO., LTD. (JP) 1995-08-15 US disclosed
EP-0628611-A1 An electrodeposition paint composition Nippon Paint Co., Ltd. (JP) 1994-12-14 EP disclosed