SCHEMBL885544

SCHEMBL885544

OC1(C(F)(F)F)C2C=CC(C2)C1(F)F

nearest known ligand 0.30

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
HTT P42858 2/20 0.30
LMNA P02545 1/20 0.30
CYP3A4 P08684 1/20 0.30
CYP2C9 P11712 1/20 0.30
CYP2C19 P33261 1/20 0.30
TDP1 Q9NUW8 1/20 0.30
KDM4E B2RXH2 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL828536 0.73
SCHEMBL199897 0.73
SCHEMBL13532349 0.71
SCHEMBL14511666 0.70
SCHEMBL1219364 0.69
SCHEMBL201416 0.69
SCHEMBL13525785 0.68 HTT (0.31) HTTLMNACYP3A4CYP2C9CYP2C19
SCHEMBL13449539 0.67 CYP3A4 (0.31) CYP3A4
SCHEMBL13526009 0.67
SCHEMBL201169 0.66

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8524439-B2 Silsesquioxane resin systems with base additives bearing electron-attracting functionalities DOW CORNING CORPORATION (US) 2013-09-03 US claimed
US-8148043-B2 Silsesquioxane resin systems with base additives bearing electron-attracting functionalities DOW CORNING CORPORATION (US) 2012-04-03 US claimed
US-20090312467-A1 SILSESQUIOXANE RESIN SYSTEMS WITH BASE ADDITIVES BEARING ELECTRON-ATTRACTING FUNCTIONALITIES DOW CORNING CORPORATION (US) 2009-12-17 US claimed
JP-2009543135-A 2009-12-03 JP claimed
US-7625687-B2 Silsesquioxane resin DOW CORNING CORPORATION (US) 2009-12-01 US claimed
US-20090202941-A1 SILSESQUIOXANE RESIN SYSTEMS WITH BASE ADDITIVES BEARING ELECTRON-ATTRACTING FUNCTIONALITIES DOW CORNING CORPORATION (US) 2009-08-13 US claimed
WO-2008002975-A2 SILSESQUIOXANE RESIN SYSTEMS WITH BASE ADDITIVES BEARING ELECTRON- ATTRACTING FUNCTIONALITIES DOW CORNING CORPORATION (US) 2008-01-03 WO claimed
WO-2008002970-A2 SILSESQUIOXANE RESIN SYSTEMS WITH BASE ADDITIVES BEARING ELECTRON-ATTRACTING FUNCTIONALITIES DOW CORNING CORPORATION (US) 2008-01-03 WO claimed
US-20070281242-A1 Silsesquioxane Resin DOW SILICONES CORPORATION 2007-12-06 US claimed
EP-1660561-A2 PHOTOSENSITIVE SILSESQUIOXANE RESIN Dow Corning Corporation (US) 2006-05-31 EP claimed
WO-2005007747-A2 PHOTOSENSITIVE SILSESQUIOXANE RESIN DOW CORNING CORPORATION (US) 2005-01-27 WO claimed
EP-1660561-B1 PHOTOSENSITIVE SILSESQUIOXANE RESIN DOW CORNING (US) 2014-02-12 EP disclosed
US-8524439-B2 Silsesquioxane resin systems with base additives bearing electron-attracting functionalities DOW CORNING CORPORATION (US) 2013-09-03 US disclosed
US-8148043-B2 Silsesquioxane resin systems with base additives bearing electron-attracting functionalities DOW CORNING CORPORATION (US) 2012-04-03 US disclosed
US-8043788-B2 Alkali soluble resin; immersion lithography SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-10-25 US disclosed
US-20070281242-A1 Silsesquioxane Resin DOW SILICONES CORPORATION 2007-12-06 US disclosed
US-20070026341-A1 Resist protective coating material and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-02-01 US disclosed
US-20070026341-A1 Resist protective coating material and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-02-01 US disclosed
EP-1660561-A2 PHOTOSENSITIVE SILSESQUIOXANE RESIN Dow Corning Corporation (US) 2006-05-31 EP disclosed
WO-2005007747-A2 PHOTOSENSITIVE SILSESQUIOXANE RESIN DOW CORNING CORPORATION (US) 2005-01-27 WO disclosed