⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8390053 | 0.86 | — | — | |
| SCHEMBL27872913 | 0.76 | — | — | |
| SCHEMBL179887 | 0.76 | — | — | |
| SCHEMBL1908373 | 0.76 | — | — | |
| SCHEMBL3424363 | 0.73 | — | — | |
| SCHEMBL3951191 | 0.71 | — | — | |
| SCHEMBL179838 | 0.71 | — | — | |
| SCHEMBL4366627 | 0.70 | — | — | |
| SCHEMBL5549502 | 0.70 | — | — | |
| SCHEMBL27995246 | 0.70 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 394 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117757422-A | anti-UV poisoning organic silicon gel composition and application thereof | 东莞市贝特利新材料有限公司 | 2024-03-26 | — | — | CN | claimed |
| CN-105722939-B | Silicone adhesive composition and solid-state imaging device | 信越化学工业株式会社 | 2019-12-17 | — | — | CN | claimed |
| CN-105838320-A | Pressure-sensitive adhesive for polaroid and polaroid | 太湖金张科技股份有限公司 | 2016-08-10 | — | — | CN | claimed |
| EP-1295927-B1 | Silicone pressure-sensitive adhesive composition and pressure-sensitive adhesive tape | SHINETSU CHEMICAL CO (JP) | 2006-11-08 | — | — | EP | claimed |
| US-20260047263-A1 | SOLAR CELL ELEMENT COATING COMPOSITION, AND SOLAR CELL MODULE AND PRODUCTION METHOD THEREFOR | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-02-12 | — | — | US | disclosed |
| EP-3862405-B1 | ULTRAVIOLET CURABLE SILICONE ADHESIVE COMPOSITION AND METHOD FOR PRODUCING MULTILAYER BODY | SHINETSU CHEMICAL CO (JP) | 2026-01-28 | — | — | EP | disclosed |
| EP-4678711-A1 | TEMPORARY ADHESIVE FOR WAFER PROCESSING, WAFER LAMINATE, AND METHOD FOR PRODUCING THIN WAFER | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-01-14 | — | — | EP | disclosed |
| EP-4679493-A1 | METHOD FOR PRODUCING THIN WAFER, WAFER LAMINATE AND TEMPORARY ADHESIVE FOR WAFER PROCESSING | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-01-14 | — | — | EP | disclosed |
| EP-4679492-A1 | TEMPORARY ADHESIVE FOR WAFER PROCESSING, WAFER PROCESSED BODY, AND METHOD FOR MANUFACTURING THIN WAFER | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-01-14 | — | — | EP | disclosed |
| EP-4678710-A1 | TEMPORARY ADHESION MATERIAL COMPOSITION AND SUBSTRATE CLEANING METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-01-14 | — | — | EP | disclosed |
| EP-4661058-A1 | CLEANING AGENT COMPOSITION AND CLEANING METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-12-10 | — | — | EP | disclosed |
| EP-4654222-A1 | DEEP EUTECTIC LIQUID, BIO-ELECTRODE COMPOSITION, BIO-ELECTRODE, AND METHOD FOR PRODUCING BIO-ELECTRODE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-26 | — | — | EP | disclosed |
| US-20040157064-A1 | Silicone adhesive composition and an adhesive tape thereof | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-08-12 | — | — | US | disclosed |
| US-6756127-B2 | ALKENYL-ENDCAPPED DIORGANOPOLYSILOXANE; ORGANOHYDROGENPOLYSILOXANE; PLATINUM BASE CURING CATALYST, AND A RETARDER. | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-06-29 | — | — | US | disclosed |
| US-20030104224-A1 | Primer composition for silicone pressure-sensitive adhesives | SHIN-ETSU CHEMICAL CO., LTD. | 2003-06-05 | — | — | US | disclosed |
| US-20030091837-A1 | Silicone pressure-sensitive adhesive composition and pressure-sensitive adhesive tape | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-05-15 | — | — | US | disclosed |
| US-6559246-B2 | Polysiloxanes | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-05-06 | — | — | US | disclosed |
| EP-1295927-A1 | Silicone pressure-sensitive adhesive composition and pressure-sensitive adhesive tape | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-03-26 | — | — | EP | disclosed |
| US-20010034408-A1 | Primer composition for silicone pressure-sensitive adhesives | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-10-25 | — | — | US | disclosed |
| EP-1136532-A2 | Primer composition for silicone pressure-sensitive adhesives | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-09-26 | — | — | EP | disclosed |