SCHEMBL890721

SCHEMBL890721

CC(S)CC(S)C(S)CS

nearest known ligand 0.35

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ANPEP P15144 1/20 0.33
ERAP2 Q6P179 1/20 0.33
ERAP1 Q9NZ08 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27752181 0.87 RNPEP (0.30)
SCHEMBL26695475 0.79 NR1I2 (0.32)
SCHEMBL28558214 0.79 ANPEP (0.32) ANPEPERAP2ERAP1
SCHEMBL1452636 0.75
SCHEMBL28095419 0.73
SCHEMBL891247 0.73
SCHEMBL28888878 0.73 NR1I2 (0.35)
SCHEMBL28518060 0.73
SCHEMBL3096553 0.71
SCHEMBL1059665 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20120082793-A1 DISPERSOID HAVING METAL-OXYGEN BONDS, METAL OXIDE FILM, AND MONOMOLECULAR FILM NIPPON SODA CO., LTD. (JP) 2012-04-05 US disclosed
EP-1422197-B1 DISPERSED INGREDIENT HAVING HAVING METAL- OXYGEN NIPPON SODA CO (JP) 2012-01-11 EP disclosed
US-20110135878-A1 Dispersoid having metal-oxygen bonds, metal oxide film, and monomolecular film NIPPON SODA, CO., LTD. (JP) 2011-06-09 US disclosed
US-7909929-B2 Dispersoid having metal-oxygen bonds, metal oxide film, and monomolecular film NIPPON SODA CO., LTD. (JP) 2011-03-22 US disclosed
US-7741376-B2 Process for preparing dispersed ingredient having metal-oxygen bonds NIPPON SODA CO., LTD. (JP) 2010-06-22 US disclosed
US-20090143498-A1 PROCESS FOR PREPARING DISPERSED INGEDIENT HAVING METAL-OXYGEN BONDS NIPPON SODA CO., LTD (JP) 2009-06-04 US disclosed
US-20060239902-A1 Dispersoid having metal-oxygen bonds, metal oxide film, and monomolecular film NIPPON SODA CO., LTD. (JP) 2006-10-26 US disclosed
EP-1580164-A1 DISPERSOID HAVING METAL-OXYGEN BOND, METAL OXIDE FILM, AND MONOMOLECULAR FILM NIPPON SODA CO., LTD. (JP) 2005-09-28 EP disclosed
US-20040197254-A1 Dispersed ingredient having metal-oxygen NIPPON SODA CO., LTD. (JP) 2004-10-07 US disclosed
EP-1422197-A1 DISPERSED INGREDIENT HAVING METAL−OXYGEN NIPPON SODA CO., LTD. (JP) 2004-05-26 EP disclosed