SCHEMBL891679

SCHEMBL891679

C=CCC(C)(C)OC(C)(C)CC=C

nearest known ligand 0.33

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
MAPT P10636 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10211159 0.79
SCHEMBL81526 0.77
SCHEMBL29015718 0.77
SCHEMBL28346244 0.77
SCHEMBL3675106 0.77
SCHEMBL28349477 0.75
SCHEMBL16668308 0.75
SCHEMBL16860206 0.75
SCHEMBL14011463 0.73
SCHEMBL28990135 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 235 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20190097070-A1 SHEET FOR SOLAR BATTERY MODULE, AND SOLAR BATTERY MODULE TORAY INDUSTRIES, INC. (JP) 2019-03-28 US claimed
CN-107650453-A A kind of packaging boxboard of high barrier, Itelligent packaging box 安徽金睐格环保科技有限公司 2018-02-02 CN claimed
EP-4711434-A1 REFRIGERANT CYCLE APPARATUS Daikin Industries, Ltd. (JP) 2026-03-18 EP disclosed
EP-4234293-B1 REFRIGERATION CYCLE DEVICE FOR VEHICLE DAIKIN IND LTD (JP) 2025-12-24 EP disclosed
US-20250115796-A1 REFRIGERATION CYCLE APPARATUS DAIKIN INDUSTRIES, LTD. (JP) 2025-04-10 US disclosed
EP-3825383-B1 REFRIGERATION CYCLE DEVICE FOR VEHICLE DAIKIN IND LTD (JP) 2024-11-06 EP disclosed
EP-3825379-B1 REFRIGERANT CYCLE DEVICE DAIKIN IND LTD (JP) 2024-10-30 EP disclosed
US-20240343896-A1 Glass Fiber Thermoplastic Polypropylene Polymer Master Batch Composite Tundra Composites, LLC (US) 2024-10-17 US disclosed
CN-111913353-B Curable resin composition, dry film, cured product, and printed wiring board 太阳控股株式会社 2024-09-03 CN disclosed
CN-111788870-B Heat-dissipating insulating resin composition and printed circuit board using same 太阳控股株式会社 2024-09-03 CN disclosed
CN-111913354-B Curable resin composition, dry film, cured product, and printed wiring board 太阳控股株式会社 2024-09-03 CN disclosed
EP-1085077-A1 REFRIGERATING MACHINE OIL COMPOSITION IDEMITSU KOSAN COMPANY LIMITED (JP) 2001-03-21 EP disclosed
CN-1061663-C fluorine-containing polymer DAIKIN IND LTD (JP) 2001-02-07 CN disclosed
CN-1280978-A Fluorine containing olefine DAIKIN IND LTD (JP) 2001-01-24 CN disclosed
EP-0906822-A1 Process for producing incompatible polymer-containing polyester film Mitsubishi Polyester Film Corporation (JP) 1999-04-07 EP disclosed
EP-0084890-B1 DIAZOTYPE HEAT DEVELOPMENT RECORDING MEDIUM Toppan Printing Co., Ltd. (JP) 1986-05-21 EP disclosed
US-4487826-A EXCELLENT SHELF LIFE AND HEAT SENSITIVITY TOPPAN PRINTING CO., LTD. (JP) 1984-12-11 US disclosed
EP-0084890-A1 Diazotype heat development recording medium Toppan Printing Co., Ltd. (JP) 1983-08-03 EP disclosed
US-4219333-A Carbonated cleaning solution HARRIS RESEARCH, INC. 1980-08-26 US disclosed
US-3932573-A Process for producing glass fiber reinforced injection molding compounds ETHYL CORPORATION (US) 1976-01-13 US disclosed