SCHEMBL8926006

SCHEMBL8926006

CCc1c(O)ccc(O)c1-c1ccccc1

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 4/20 0.57
ESR2 Q92731 4/20 0.57
GCGR P47871 1/20 0.44
USP7 Q93009 2/20 0.43
POLB P06746 1/20 0.42
RECQL P46063 1/20 0.42
SMN1; SMN2 Q16637 1/20 0.42
ALOX5 P09917 1/20 0.39
LMNA P02545 1/20 0.39
PDE4A P27815 1/20 0.38
PDE4B Q07343 1/20 0.38
PDE4C Q08493 1/20 0.38
PDE4D Q08499 1/20 0.38
BACE1 P56817 1/20 0.38
PTGS1 P23219 1/20 0.38
PTGS2 P35354 1/20 0.38
KDM4E B2RXH2 1/20 0.38
RCE1 Q9Y256 1/20 0.38
CYP1A2 P05177 1/20 0.38
CYP3A4 P08684 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30234292 0.86 ESR2 (0.53) ESR1ESR2GCGRUSP7POLB
SCHEMBL2201812 0.86 ESR2 (0.53) ESR1ESR2GCGRUSP7POLB
SCHEMBL983106 0.86 ESR1 (0.53) ESR1ESR2GCGRUSP7POLB
SCHEMBL983995 0.86 ESR1 (0.53) ESR1ESR2GCGRUSP7POLB
SCHEMBL30294156 0.85 ESR1 (0.51) ESR1ESR2GCGRUSP7POLB
SCHEMBL2860930 0.85 ESR1 (0.51) ESR1ESR2GCGRUSP7POLB
SCHEMBL20658230 0.85 ESR2 (0.51) ESR1ESR2GCGRUSP7POLB
SCHEMBL17473174 0.84 ESR1 (0.46) ESR1ESR2GCGRUSP7ALOX5
SCHEMBL11222274 0.82 ESR1 (0.49) ESR1ESR2GCGRUSP7POLB
Formaldehyde SCHEMBL29141443 0.82 ESR2 (0.49) ESR1ESR2GCGRUSP7POLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4871817-A IMPROVED HEAT DISTORTION TEMPERATURE, FLEXURAL MODULUS, SPECIFIC GRAVITY, TENSILE STRENGTH GENERAL ELECTRIC COMPANY (US) 1989-10-03 US claimed
JP-1045327-A None JP disclosed
CN-118271571-A Modified phenolic epoxy resin and preparation method thereof, conductive silver paste and preparation method thereof 深圳新宙邦科技股份有限公司 2024-07-02 CN disclosed
CN-118221909-A Modified epoxy resin, preparation method and HJT conductive silver paste 深圳新宙邦科技股份有限公司 2024-06-21 CN disclosed
CN-102105439-B Method for producing N-substituted carbamate and method for producing isocyanate using the N-substituted carbamate ASAHI KASEI CHEMICALS CORP. (JP) 2016-04-20 CN disclosed
US-5621041-A Compatible liquid crystal polymer/polyolefin blends CENTER FOR INNOVATIVE TECHNOLOGY (US) 1997-04-15 US disclosed
WO-1992018568-A1 COMPATIBLE LIQUID CRYSTAL POLYMER/POLYOLEFIN BLENDS VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY (US) 1992-10-29 WO disclosed
US-4871817-A IMPROVED HEAT DISTORTION TEMPERATURE, FLEXURAL MODULUS, SPECIFIC GRAVITY, TENSILE STRENGTH GENERAL ELECTRIC COMPANY (US) 1989-10-03 US disclosed
US-4153779-A Liquid crystal copolyester containing a substituted phenylhydroquinone EASTMAN KODAK COMPANY (US) 1979-05-08 US disclosed