⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28300737 | 0.87 | — | — | |
| SCHEMBL2838086 | 0.87 | — | — | |
| SCHEMBL14694559 | 0.87 | — | — | |
| SCHEMBL28628975 | 0.87 | — | — | |
| Water SCHEMBL1797774 | 0.87 | — | — | |
| Water SCHEMBL23527378 | 0.87 | — | — | |
| SCHEMBL28012740 | 0.87 | — | — | |
| Water SCHEMBL19019960 | 0.87 | — | — | |
| Water SCHEMBL21753442 | 0.87 | — | — | |
| SCHEMBL8731240 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-120138338-A | Method for efficiently separating indium tin silver ternary alloy | 昆明理工大学 | 2025-06-13 | — | — | CN | claimed |
| CN-110429153-B | Lamination assembly interconnection structure and manufacturing method thereof | 通威太阳能（合肥）有限公司 | 2025-02-14 | — | — | CN | claimed |
| CN-110429153-A | A kind of stacked wafer moudle interconnection architecture and preparation method thereof | TONGWEI SOLAR HEFEI CO LTD | 2019-11-08 | — | — | CN | claimed |
| CN-110306079-A | A kind of low melting point liquid metal and the preparation method and application thereof | 云南科威液态金属谷研发有限公司 | 2019-10-08 | — | — | CN | claimed |
| CN-120138338-B | Method for separating indium tin silver ternary alloy | 昆明理工大学 | 2025-11-14 | — | — | CN | disclosed |
| CN-120138338-A | Method for efficiently separating indium tin silver ternary alloy | 昆明理工大学 | 2025-06-13 | — | — | CN | disclosed |
| CN-120138338-A | Method for efficiently separating indium tin silver ternary alloy | 昆明理工大学 | 2025-06-13 | — | — | CN | disclosed |
| CN-110429153-B | Lamination assembly interconnection structure and manufacturing method thereof | 通威太阳能（合肥）有限公司 | 2025-02-14 | — | — | CN | disclosed |
| CN-110429153-B | Lamination assembly interconnection structure and manufacturing method thereof | 通威太阳能（合肥）有限公司 | 2025-02-14 | — | — | CN | disclosed |
| CN-221478211-U | Multifunctional protective packaging material | 东莞市鸿艺电子有限公司 | 2024-08-06 | — | — | CN | disclosed |
| CN-116555913-A | Ni3Sn single crystal phase alloy material and preparation method thereof | 宁波东大神乐电工合金有限公司 | 2023-08-08 | — | — | CN | disclosed |
| CN-110306079-B | Low-melting-point liquid metal and preparation method and application thereof | 云南科威液态金属谷研发有限公司 | 2021-01-26 | — | — | CN | disclosed |
| CN-111118328-A | Silver tin oxide indium oxide electrical contact material and preparation method thereof | 佛山市诺普材料科技有限公司 | 2020-05-08 | — | — | CN | disclosed |
| CN-111091983-A | Silver tin oxide indium oxide electrical contact material and preparation process thereof | 佛山市诺普材料科技有限公司 | 2020-05-01 | — | — | CN | disclosed |
| CN-210379078-U | Lamination subassembly interconnect structure | 通威太阳能（合肥）有限公司 | 2020-04-21 | — | — | CN | disclosed |
| CN-110429153-A | A kind of stacked wafer moudle interconnection architecture and preparation method thereof | TONGWEI SOLAR HEFEI CO LTD | 2019-11-08 | — | — | CN | disclosed |
| CN-110429153-A | A kind of stacked wafer moudle interconnection architecture and preparation method thereof | TONGWEI SOLAR HEFEI CO LTD | 2019-11-08 | — | — | CN | disclosed |
| CN-110306079-A | A kind of low melting point liquid metal and the preparation method and application thereof | 云南科威液态金属谷研发有限公司 | 2019-10-08 | — | — | CN | disclosed |
| CN-107635717-A | lead-free solder based on indium-tin-silver | 安塔亚技术公司 | 2018-01-26 | — | — | CN | disclosed |
| US-5607522-A | Method of making electrical contact material | TEXAS INSTRUMENTS INCORPORATED (US) | 1997-03-04 | — | — | US | disclosed |