Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP3A4 | P08684 | 4/20 | 0.48 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.48 |
| ▸ | GABRA1 | P14867 | 3/20 | 0.47 |
| ▸ | GABRB2 | P47870 | 3/20 | 0.47 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.47 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.47 |
| ▸ | TSHR | P16473 | 1/20 | 0.45 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.31 |
| ▸ | HPGD | P15428 | 1/20 | 0.31 |
| ▸ | CSNK2A2 | P19784 | 1/20 | 0.30 |
| ▸ | CSNK2B | P67870 | 1/20 | 0.30 |
| ▸ | CSNK2A1 | P68400 | 1/20 | 0.30 |
| ▸ | CSNK2A3 | Q8NEV1 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6408777 | 0.89 | CYP3A4 (0.44) | CYP3A4TRPA1GABRA1GABRB2TDP1 | |
| SCHEMBL24999152 | 0.82 | CYP3A4 (0.61) | CYP3A4TRPA1GABRA1GABRB2TDP1 | |
| SCHEMBL109348 | 0.82 | CYP3A4 (0.56) | CYP3A4TRPA1GABRA1GABRB2TDP1 | |
| SCHEMBL281996 | 0.81 | MAPK1 (0.63) | CYP3A4TRPA1GABRA1GABRB2TDP1 | |
| SCHEMBL1516761 | 0.80 | CYP3A4 (0.42) | CYP3A4TRPA1GABRA1GABRB2TDP1 | |
| SCHEMBL314237 | 0.78 | CYP3A4 (0.61) | CYP3A4TRPA1GABRA1GABRB2TDP1 | |
| SCHEMBL29376372 | 0.78 | CYP3A4 (0.61) | CYP3A4TRPA1GABRA1GABRB2TDP1 | |
| SCHEMBL10965734 | 0.78 | CYP3A4 (0.47) | CYP3A4TRPA1GABRA1GABRB2TDP1 | |
| SCHEMBL10968102 | 0.78 | CYP3A4 (0.47) | CYP3A4TRPA1GABRA1GABRB2TDP1 | |
| SCHEMBL7059557 | 0.78 | CYP3A4 (0.41) | CYP3A4TRPA1GABRA1GABRB2TDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 145 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0624612-A1 | Biostable polyurethane and medical article therefrom | Becton, Dickinson and Company (US) | 1994-11-17 | — | — | EP | claimed |
| CN-118339250-A | Adhesive composition, and adhesive sheet, laminate and printed wiring board each comprising same | 东洋纺艾睦希株式会社 | 2024-07-12 | — | — | CN | disclosed |
| US-20240227373-A1 | MULTILAYER BODY OF INORGANIC SUBSTRATE AND TRANSPARENT HEAT-RESISTANT POLYMER FILM | TOYOBO CO., LTD. (JP) | 2024-07-11 | — | — | US | disclosed |
| US-20240227363-A1 | LAMINATE OF INORGANIC SUBSTRATE AND HEAT-RESISTANT POLYMER FILM | TOYOBO CO., LTD. (JP) | 2024-07-11 | — | — | US | disclosed |
| CN-113950409-B | Laminate body | 东洋纺株式会社 | 2024-06-28 | — | — | CN | disclosed |
| EP-4389419-A1 | TRANSPARENT HEAT-RESISTANT LAMINATED FILM | TOYOBO CO., LTD. (JP) | 2024-06-26 | — | — | EP | disclosed |
| WO-2024111181-A1 | THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT | ポリプラ・エボニック株式会社 | 2024-05-30 | — | — | WO | disclosed |
| EP-4371766-A1 | LAMINATE OF INORGANIC SUBSTRATE AND HEAT-RESISTANT POLYMER FILM | TOYOBO CO., LTD. (JP) | 2024-05-22 | — | — | EP | disclosed |
| EP-4371767-A1 | MULTILAYER BODY OF INORGANIC SUBSTRATE AND TRANSPARENT HEAT-RESISTANT POLYMER FILM | TOYOBO CO., LTD. (JP) | 2024-05-22 | — | — | EP | disclosed |
| US-11988981-B2 | Endless belt, transfer device, and image forming apparatus | FUJIFILM BUSINESS INNOVATION CORP. (JP) | 2024-05-21 | — | — | US | disclosed |
| WO-2006088272-A1 | ENAMEL VANISH COMPOSITION FOR ENAMEL WIRE AND ENAMEL WIRE USING THE SAME | LS CABLE LTD. (KR) | 2006-08-24 | — | — | WO | disclosed |
| EP-0977209-B1 | INSULATED WIRE | FURUKAWA ELECTRIC CO LTD (JP) | 2006-07-12 | — | — | EP | disclosed |
| US-20050136245-A1 | Intermediate transfer medium, film forming liquid for the intermediate transfer medium and image forming apparatus using intermediate transfer medium | RICOH COMPANY LIMITED (JP) | 2005-06-23 | — | — | US | disclosed |
| EP-1011107-B1 | Insulated wire | SUMITOMO ELECTRIC WINTEC INC (JP) | 2004-09-22 | — | — | EP | disclosed |
| US-6436537-B1 | INSULATED WIRES WITH POLYAMIDEIMIDE COPOLYMERS | THE FURUKAWA ELECTRIC CO., LTD. (JP) | 2002-08-20 | — | — | US | disclosed |
| EP-1011107-A1 | Insulated wire | Sumitomo Electric Industries, Ltd. (JP) | 2000-06-21 | — | — | EP | disclosed |
| EP-0977209-A1 | INSULATED WIRE | THE FURUKAWA ELECTRIC CO., LTD. (JP) | 2000-02-02 | — | — | EP | disclosed |
| EP-0543409-B1 | Insulated wire | SUMITOMO ELECTRIC INDUSTRIES (JP) | 1996-07-17 | — | — | EP | disclosed |
| US-5356708-A | Conductor and insulating coating made from polyamideimide base coating | SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) | 1994-10-18 | — | — | US | disclosed |
| EP-0543409-A2 | Insulated wire | SUMITOMO ELECTRIC INDUSTRIES, LTD (JP) | 1993-05-26 | — | — | EP | disclosed |