Salicyladehyde

Salicyladehyde

SCHEMBL8958321

O=Cc1ccccc1O.O=Cc1ccccc1O.[Cu]

nearest known ligand 0.95

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Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ TRIM24 O15164 1/20 0.95
▸ TRIM33 Q9UPN9 1/20 0.95
▸ CDK4 P11802 1/20 0.64
▸ CCND1 P24385 1/20 0.64
▸ ERN1 O75460 5/20 0.62
▸ LMNA P02545 2/20 0.60
▸ MEN1 O00255 1/20 0.60
▸ THRB P10828 1/20 0.60
▸ BLM P54132 1/20 0.60
▸ KMT2A Q03164 1/20 0.60
▸ TDP1 Q9NUW8 1/20 0.60
▸ NFKB1 P19838 2/20 0.52
▸ JUN P05412 1/20 0.52
▸ NFE2L2 Q16236 1/20 0.52
▸ CA2 P00918 4/20 0.52
▸ CA1 P00915 2/20 0.52
▸ CA4 P22748 1/20 0.50
▸ MAPT P10636 1/20 0.48
▸ TRPA1 O75762 1/20 0.48
▸ ALDH1A1 P00352 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Salicyladehyde SCHEMBL6151947 1.00 TRIM24 (0.95) TRIM24TRIM33CDK4CCND1ERN1
Salicyladehyde SCHEMBL30368620 1.00 TRIM24 (0.95) TRIM24TRIM33CDK4CCND1ERN1
Salicyladehyde SCHEMBL29617542 1.00 TRIM24 (0.95) TRIM24TRIM33CDK4CCND1ERN1
Salicyladehyde SCHEMBL29386538 0.97 — —
Salicyladehyde SCHEMBL901265 0.97 TRIM24 (1.00) TRIM24TRIM33CDK4CCND1ERN1
Salicyladehyde SCHEMBL15395 0.97 — —
Salicyladehyde SCHEMBL23389487 0.95 TRIM24 (0.95) TRIM24TRIM33CDK4CCND1ERN1
Salicyladehyde SCHEMBL6917405 0.95 TRIM24 (0.95) TRIM24TRIM33CDK4CCND1ERN1
Salicyladehyde SCHEMBL10888961 0.95 TRIM24 (0.95) TRIM24TRIM33CDK4CCND1ERN1
Salicyladehyde SCHEMBL1845239 0.95 TRIM24 (0.95) TRIM24TRIM33CDK4CCND1ERN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5512515-A REACTING MIXTURE OF TRI(OR DI-)ALKYL ALUMINUM COMPOUNDS, COPPER COMPLEXES AND MONO-, DI- OR TRI-SILANES NEAR HEATED SUBSTRATE SURFACE YIELDS SMOOTH, UNIFORM THIN FILM NIPPON STEEL CORPORATION (JP) 1996-04-30 — — US claimed
EP-0572763-B1 Molding composition ASAHI GLASS CO LTD (JP) 1996-10-02 — — EP disclosed
US-5512515-A REACTING MIXTURE OF TRI(OR DI-)ALKYL ALUMINUM COMPOUNDS, COPPER COMPLEXES AND MONO-, DI- OR TRI-SILANES NEAR HEATED SUBSTRATE SURFACE YIELDS SMOOTH, UNIFORM THIN FILM NIPPON STEEL CORPORATION (JP) 1996-04-30 — — US disclosed
EP-0572763-A2 Molding composition ASAHI GLASS COMPANY LTD. (JP) 1993-12-08 — — EP disclosed
EP-0041662-B1 RESIN ENCAPSULATION TYPE SEMICONDUCTOR DEVICE KABUSHIKI KAISHA TOSHIBA (JP) 1984-04-11 — — EP disclosed
EP-0041662-A1 Resin encapsulation type semiconductor device KABUSHIKI KAISHA TOSHIBA (JP) 1981-12-16 — — EP disclosed
US-4136097-A COPPER(II) COMPLEX AS PROMOTER MCNEIL LABORATORIES, INC. (US) 1979-01-23 — — US disclosed
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