SCHEMBL8973667

SCHEMBL8973667

Cc1cccc(C)c1CCCc1nc2cccc(C)c2[nH]1

nearest known ligand 0.45

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
POLB P06746 1/20 0.45
KMT2A Q03164 1/20 0.44
PARP1 P09874 1/20 0.40
CYP2D6 P10635 1/20 0.38
CYP2C19 P33261 1/20 0.38
NR2F2 P24468 1/20 0.37
PDE10A Q9Y233 1/20 0.37
CFB P00751 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6755253 0.87 PARP1 (0.54) POLBKMT2APARP1
SCHEMBL6753970 0.86 PARP1 (0.49) POLBPARP1
SCHEMBL6753951 0.84 PARP1 (0.48) POLBPARP1NR2F2
SCHEMBL6757114 0.84 PARP1 (0.48) POLBPARP1NR2F2
SCHEMBL6757219 0.84 PARP1 (0.48) POLBPARP1NR2F2
SCHEMBL6756154 0.84 PARP1 (0.48) POLBPARP1NR2F2
SCHEMBL6755305 0.84 PARP1 (0.48) POLBPARP1NR2F2
SCHEMBL6759164 0.84 PARP1 (0.48) POLBPARP1NR2F2
SCHEMBL6756129 0.84 PARP1 (0.48) POLBPARP1NR2F2
SCHEMBL6759153 0.84 PARP1 (0.48) POLBPARP1NR2F2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0551112-B1 Benzimidazole derivative and composition for treating copper and copper alloy surfaces comprising the same MEC CO LTD (JP) 1996-04-03 EP disclosed
US-5476947-A Excellent rust preventing effect, useful as corrosion resistance protective coating in printed wiring boards MEC CO., LTD. (JP) 1995-12-19 US disclosed
US-5435860-A Corrosion resistance for printed circuits MEC CO., LTD. (JP) 1995-07-25 US disclosed
EP-0551112-A1 Benzimidazole derivative and composition for treating copper and copper alloy surfaces comprising the same MEC CO., Ltd. (JP) 1993-07-14 EP disclosed