⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4525096 | 0.87 | — | — | |
| SCHEMBL31285457 | 0.87 | — | — | |
| SCHEMBL8181571 | 0.87 | — | — | |
| SCHEMBL29062384 | 0.87 | — | — | |
| SCHEMBL24184 | 0.82 | — | — | |
| SCHEMBL108635 | 0.82 | — | — | |
| SCHEMBL1199413 | 0.82 | — | — | |
| SCHEMBL4364395 | 0.82 | — | — | |
| SCHEMBL4551667 | 0.82 | — | — | |
| SCHEMBL31373848 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2025095690-A1 | ALLOY COMPOSITION, TIECOAT LAYER FORMED FROM ALLOY COMPOSITION, WIRING LAYER, AND FLEXIBLE CIRCUIT BOARD INCLUDING SAME WIRING LAYER | 주식회사 큐프럼 머티리얼즈 | 2025-05-08 | — | — | WO | claimed |
| CN-119349811-A | Zinc-nickel-chromium waste liquid treatment system and treatment method thereof | 江西华创新材有限公司 | 2025-01-24 | — | — | CN | claimed |
| CN-221940276-U | Recovery system for copper foil production wastewater | 西安德奇水处理有限公司 | 2024-11-01 | — | — | CN | claimed |
| CN-117767669-A | Stepping motor with encoder control | 陕西轩意光电科技有限公司 | 2024-03-26 | — | — | CN | claimed |
| CN-116272759-A | Method for converting methane by using plasma | 中国石油化工股份有限公司 | 2023-06-23 | — | — | CN | claimed |
| CN-113943950-B | Multi-metal hydroxide pre-catalyst and preparation method and application thereof | 西安工业大学 | 2022-10-14 | — | — | CN | claimed |
| CN-113322496-B | Copper foil for LED light bar plate, complete production equipment and production method | 浙江花园新能源股份有限公司 | 2022-08-09 | — | — | CN | claimed |
| US-20220163882-A1 | Extreme Ultraviolet Mask Blank With Alloy Absorber And Method Of Manufacture | APPLIED MATERIALS, INC. (US) | 2022-05-26 | — | — | US | claimed |
| CN-113337862-B | Surface treatment process of 0.1 mm ultra-width rolled copper foil | 浙江花园新能源股份有限公司 | 2022-05-24 | — | — | CN | claimed |
| CN-113322495-B | High-tensile double-light lithium battery copper foil and production process thereof | 浙江花园新能源股份有限公司 | 2022-04-26 | — | — | CN | claimed |
| CN-113943950-A | Multi-metal hydroxide pre-catalyst and preparation method and application thereof | 西安工业大学 | 2022-01-18 | — | — | CN | claimed |
| US-20260145996-A1 | ELECTROCHROMIC GLAZING | SAINT-GOBAIN GLASS FRANCE (FR) | 2026-05-28 | — | — | US | disclosed |
| CN-120019325-A | Electrochromic glazing | 法国圣戈班玻璃厂 | 2025-05-16 | — | — | CN | disclosed |
| WO-2025095690-A1 | ALLOY COMPOSITION, TIECOAT LAYER FORMED FROM ALLOY COMPOSITION, WIRING LAYER, AND FLEXIBLE CIRCUIT BOARD INCLUDING SAME WIRING LAYER | 주식회사 큐프럼 머티리얼즈 | 2025-05-08 | — | — | WO | disclosed |
| WO-2025095690-A1 | ALLOY COMPOSITION, TIECOAT LAYER FORMED FROM ALLOY COMPOSITION, WIRING LAYER, AND FLEXIBLE CIRCUIT BOARD INCLUDING SAME WIRING LAYER | 주식회사 큐프럼 머티리얼즈 | 2025-05-08 | — | — | WO | disclosed |
| CN-108976987-A | Hydrophobic anti-corrosive powder paint and preparation method thereof | 江苏华光新材料科技有限公司 | 2018-12-11 | — | — | CN | disclosed |
| CN-105950177-A | Preparation method of soil conditioner for restoring heavy metal pollution | 仇颖超 | 2016-09-21 | — | — | CN | disclosed |
| EP-0557073-B1 | Copper foil for printed circuits and process for producing the same | NIKKO GOULD FOIL KK (JP) | 1996-03-27 | — | — | EP | disclosed |
| US-5389446-A | Having coating layer of chromium oxide, nickel and either or both of zinc and zinc oxide | NIKKO GOULD FOIL CO., LTD. (JP) | 1995-02-14 | — | — | US | disclosed |
| EP-0557073-A1 | Copper foil for printed circuits and process for producing the same | NIKKO GOULD FOIL CO., LTD. (JP) | 1993-08-25 | — | — | EP | disclosed |