SCHEMBL8982575

SCHEMBL8982575

Nc1ccc(C2=CCC(OC3(c4ccc(N)cc4)C=CC(c4ccc(N)cc4)=CC3)(c3ccc(N)cc3)C=C2)cc1

nearest known ligand 0.31

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.31
TP53 P04637 1/20 0.31
CYP3A4 P08684 1/20 0.31
TDP1 Q9NUW8 1/20 0.31
L3MBTL1 Q9Y468 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15520123 0.80
SCHEMBL2403790 0.77 CYP3A4 (0.40) ALDH1A1TP53CYP3A4TDP1
SCHEMBL6709171 0.73 CYP3A4 (0.38) ALDH1A1TP53CYP3A4TDP1L3MBTL1
SCHEMBL2543904 0.73 CYP3A4 (0.36) ALDH1A1TP53CYP3A4TDP1
SCHEMBL5852516 0.72 HSD17B10 (0.46) ALDH1A1TP53CYP3A4TDP1
SCHEMBL25383769 0.71 HSD17B10 (0.39) ALDH1A1CYP3A4TDP1L3MBTL1
SCHEMBL7169779 0.71 HSD17B10 (0.39) ALDH1A1CYP3A4TDP1L3MBTL1
SCHEMBL714828 0.71 CYP3A4 (0.39) ALDH1A1TP53CYP3A4TDP1
SCHEMBL8953979 0.70 HSD17B10 (0.42) ALDH1A1TP53CYP3A4TDP1
Hydrochloric Acid SCHEMBL8638713 0.70 CYP3A4 (0.38) ALDH1A1TP53CYP3A4TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0383461-B1 A process for producing a flexible printed base CHISSO CORP (JP) 1996-05-08 EP disclosed
EP-0349269-B1 Flexible copper-clad substrates CHISSO CORP (JP) 1994-06-15 EP disclosed
US-5192619-A Polyamides polyimides silicone supports and copper foils formed by condensation reactions on copper foils CHISSO CORPORATION (JP) 1993-03-09 US disclosed
US-5077084-A PROCESS FOR PRODUCING A FLEXIBLE PRINTED BASE CHISSO CORPORATION (JP) 1991-12-31 US disclosed
EP-0383461-A2 A process for producing a flexible printed base CHISSO CORPORATION (JP) 1990-08-22 EP disclosed
EP-0349269-A2 Flexible copper-clad substrates Chisso Corporation (JP) 1990-01-03 EP disclosed