⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Silicate SCHEMBL11729521 | 0.94 | — | — | |
| Silicate SCHEMBL14876524 | 0.94 | — | — | |
| Silicate SCHEMBL1018 | 0.94 | — | — | |
| Silicate SCHEMBL7970582 | 0.94 | — | — | |
| Silicate SCHEMBL93958 | 0.94 | — | — | |
| Silicate SCHEMBL23200389 | 0.94 | — | — | |
| Silicate SCHEMBL643227 | 0.94 | — | — | |
| Silicate SCHEMBL1650898 | 0.94 | — | — | |
| Silicate SCHEMBL15352553 | 0.91 | — | — | |
| Silicate SCHEMBL7206177 | 0.89 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5510300-A | LOW TEMPERATURE LEAD OXIDE-BORON OXIDE GLASS MIXTURE SEALS CONSISTING OF SYNTHETIC HEAT-TREATED OXIDE; HIGH SEAL STRENGTH | SAMSUNG CORNING CO., LTD. (KR) | 1996-04-23 | — | — | US | claimed |
| JP-7206473-A | — | — | None | — | — | JP | disclosed |
| US-5510300-A | LOW TEMPERATURE LEAD OXIDE-BORON OXIDE GLASS MIXTURE SEALS CONSISTING OF SYNTHETIC HEAT-TREATED OXIDE; HIGH SEAL STRENGTH | SAMSUNG CORNING CO., LTD. (KR) | 1996-04-23 | — | — | US | disclosed |
| US-5510300-A | LOW TEMPERATURE LEAD OXIDE-BORON OXIDE GLASS MIXTURE SEALS CONSISTING OF SYNTHETIC HEAT-TREATED OXIDE; HIGH SEAL STRENGTH | SAMSUNG CORNING CO., LTD. (KR) | 1996-04-23 | — | — | US | disclosed |
| JP-H07206473-A | LOW MELTING POINT ADHESIVE GLASS COMPOSITION USING COMPOSITE FILLER | SAMSUNG CORNING CO LTD | 1995-08-08 | — | — | JP | disclosed |