SCHEMBL8994764

SCHEMBL8994764

O[Si](O)(O)O.[AlH3].[MgH2].[Zr]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11729525 0.93
SCHEMBL1020 0.93
SCHEMBL27615250 0.93
SCHEMBL28081769 0.93
SCHEMBL1650901 0.93
SCHEMBL14876525 0.93
SCHEMBL643228 0.93
SCHEMBL15352563 0.88
SCHEMBL8840187 0.86
SCHEMBL314838 0.86

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5510300-A LOW TEMPERATURE LEAD OXIDE-BORON OXIDE GLASS MIXTURE SEALS CONSISTING OF SYNTHETIC HEAT-TREATED OXIDE; HIGH SEAL STRENGTH SAMSUNG CORNING CO., LTD. (KR) 1996-04-23 US claimed
JP-7206473-A None JP disclosed
US-5510300-A LOW TEMPERATURE LEAD OXIDE-BORON OXIDE GLASS MIXTURE SEALS CONSISTING OF SYNTHETIC HEAT-TREATED OXIDE; HIGH SEAL STRENGTH SAMSUNG CORNING CO., LTD. (KR) 1996-04-23 US disclosed
US-5510300-A LOW TEMPERATURE LEAD OXIDE-BORON OXIDE GLASS MIXTURE SEALS CONSISTING OF SYNTHETIC HEAT-TREATED OXIDE; HIGH SEAL STRENGTH SAMSUNG CORNING CO., LTD. (KR) 1996-04-23 US disclosed
JP-H07206473-A LOW MELTING POINT ADHESIVE GLASS COMPOSITION USING COMPOSITE FILLER SAMSUNG CORNING CO LTD 1995-08-08 JP disclosed