⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL899798 | 1.00 | — | — | |
| SCHEMBL899723 | 0.81 | — | — | |
| SCHEMBL20445738 | 0.72 | — | — | |
| SCHEMBL31728361 | 0.72 | — | — | |
| SCHEMBL899988 | 0.72 | — | — | |
| SCHEMBL11649972 | 0.72 | — | — | |
| SCHEMBL899983 | 0.72 | — | — | |
| SCHEMBL899977 | 0.70 | — | — | |
| SCHEMBL899978 | 0.70 | — | — | |
| SCHEMBL5967513 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2022231233-A1 | EPOXY RESIN WITH IMPROVED WATER RESISTANCE AND COMPOSITION COMPRISING SAME | 주식회사 삼양사 | 2022-11-03 | — | — | WO | claimed |
| EP-2621990-B1 | THERMOSETTABLE COMPOSITIONS AND THERMOSETS THEREFROM | BLUE CUBE IP LLC (US) | 2016-02-24 | — | — | EP | claimed |
| EP-2621991-B1 | PROCESS FOR PREPARING EPOXY RESINS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2015-07-01 | — | — | EP | claimed |
| US-8962792-B2 | Process for preparing epoxy resins | DOW GLOBAL TECHNOLOGIES LLC (US) | 2015-02-24 | — | — | US | claimed |
| US-20140194554-A1 | EPOXY RESIN COMPOSITIONS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2014-07-10 | — | — | US | claimed |
| US-20130302336-A1 | DISULFIDE STABILIZED DVD-IG MOLECULES | UCB PHARMA S.A. (BE) | 2013-11-14 | — | — | US | claimed |
| US-20130237642-A1 | THERMOSETTABLE COMPOSITIONS AND THERMOSETS THEREFROM | DOW GLOBAL TECHNOLOGIES LLC (US) | 2013-09-12 | — | — | US | claimed |
| EP-2621994-A1 | EPOXY RESIN COMPOSITIONS | Dow Global Technologies LLC (US) | 2013-08-07 | — | — | EP | claimed |
| EP-2621990-A2 | THERMOSETTABLE COMPOSITIONS AND THERMOSETS THEREFROM | Dow Global Technologies LLC (US) | 2013-08-07 | — | — | EP | claimed |
| EP-2621991-A1 | PROCESS FOR PREPARING EPOXY RESINS | Dow Global Technologies LLC (US) | 2013-08-07 | — | — | EP | claimed |
| US-20130178601-A1 | PROCESS FOR PREPARING EPOXY RESINS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2013-07-11 | — | — | US | claimed |
| WO-2012047420-A2 | THERMOSETTABLE COMPOSITIONS AND THERMOSETS THEREFROM | DOW GLOBAL TECHNOLOGIES LLC (US) | 2012-04-12 | — | — | WO | claimed |
| WO-2012044442-A1 | PROCESS FOR PREPARING EPOXY RESINS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2012-04-05 | — | — | WO | claimed |
| WO-2012044443-A1 | EPOXY RESIN COMPOSITIONS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2012-04-05 | — | — | WO | claimed |
| WO-2022231233-A1 | EPOXY RESIN WITH IMPROVED WATER RESISTANCE AND COMPOSITION COMPRISING SAME | 주식회사 삼양사 | 2022-11-03 | — | — | WO | disclosed |
| EP-2621995-B1 | ADVANCED EPOXY RESIN COMPOSITIONS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2016-03-23 | — | — | EP | disclosed |
| US-9284434-B2 | Epoxy resin compositions | BLUE CUBE IP LLC (US) | 2016-03-15 | — | — | US | disclosed |
| US-6949285-B1 | comprises polyurethane elastomer with hard and soft segments and lithium borate | BASF AKTIENGESELLSCHAFT (DE) | 2005-09-27 | — | — | US | disclosed |
| EP-1142044-A1 | MEMBRANE SUITABLE FOR ELECTROCHEMICAL CELLS | BASF AKTIENGESELLSCHAFT (DE) | 2001-10-10 | — | — | EP | disclosed |
| WO-2000033406-A1 | MEMBRANE SUITABLE FOR ELECTROCHEMICAL CELLS | BASF AKTIENGESELLSCHAFT (DE) | 2000-06-08 | — | — | WO | disclosed |