SCHEMBL900055

SCHEMBL900055

CC(C)=C1C=CC=CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24913123 0.79
SCHEMBL14135675 0.78
SCHEMBL10742228 0.76
SCHEMBL31543061 0.76
SCHEMBL28011840 0.76
SCHEMBL5987675 0.76
SCHEMBL28284401 0.72
SCHEMBL23430432 0.71
SCHEMBL12950786 0.71
SCHEMBL28225803 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240174623-A1 Build UP Film Curable Compositions AGC Multi Material America, Inc. 2024-05-30 US disclosed
US-20240174802-A1 Build UP Film Curable Compositions AGC MULTI MAT AMERICA INC (US) 2024-05-30 US disclosed
CN-111971316-B Mixtures of aminosilyl-functionalized styrenes, their preparation and their use in the production of elastomeric copolymers 西索斯公司 2023-07-11 CN disclosed
CN-111051605-B Artificial leather and method for producing same 乐金华奥斯株式会社 2023-04-18 CN disclosed
US-11446845-B2 Method for manufacturing FRP precursor and method for manufacturing FRP SHOWA DENKO MATERIALS CO., LTD. (JP) 2022-09-20 US disclosed
CN-111971316-A Mixtures of aminosilyl-functionalized styrenes, their preparation and their use in the production of elastomeric copolymers 西索斯公司 2020-11-20 CN disclosed
EP-3642257-A1 METHOD FOR CONNECTING MOLDED BODIES BY INJECTING A SINGLE-COMPONENT HEAT-CURING EPOXY RESIN COMPOSITION INTO CAVITIES Sika Technology AG (CH) 2020-04-29 EP disclosed
WO-2018234534-A1 METHOD FOR CONNECTING MOLDED BODIES BY INJECTING A SINGLE-COMPONENT HEAT-CURING EPOXY RESIN COMPOSITION INTO CAVITIES SIKA TECHNOLOGY AG (CH) 2018-12-27 WO disclosed
EP-3207074-A1 POLYESTER PREPOLYMERS AS IMPACT MODIFIERS IN EPOXY FORMULATIONS Sika Technology AG (CH) 2017-08-23 EP disclosed
WO-2016059043-A1 POLYESTER PREPOLYMERS AS IMPACT MODIFIERS IN EPOXY FORMULATIONS SIKA TECHNOLOGY AG (CH) 2016-04-21 WO disclosed
CN-102844397-A Two-component structural adhesive which is impact resistant at room temperature SIKA TECHNOLOGY AG 2012-12-26 CN disclosed
CN-102844348-A Amino group terminated impact strength modifier and use thereof in epoxy resin compositions SIKA TECHNOLOGY AG 2012-12-26 CN disclosed
CN-102585874-A Pyrolysis device for producing larger quantity of aromatic compounds CHARLIE HOLDING INTELLECTUAL PROPERTY INC 2012-07-18 CN disclosed
WO-2012042058-A1 IMPACT RESISTANCE MODIFIERS FOR EPOXY RESIN COMPOSITIONS SIKA TECHNOLOGY AG (CH) 2012-04-05 WO disclosed
CN-100358909-C Bidentate C, P chiral phosphine ligands HOFFMANN LA ROCHE (CH) 2008-01-02 CN disclosed
CN-101076577-A Pyrolysis process and apparatus for producing increased amounts of aromatic compounds CHARLIE HOLDING INTELLECTUAL P (US) 2007-11-21 CN disclosed
CN-1263718-C Method for recovering material values from bisphenol tars GEN ELECTRIC (US) 2006-07-12 CN disclosed
CN-1717410-A Bidentate C, P chiral phosphine ligand HOFFMANN LA ROCHE (CH) 2006-01-04 CN disclosed
CN-1474796-A Method for recovering material values from bisphenol tars ͨ�õ�����˾ 2004-02-11 CN disclosed
EP-0273643-A2 Conducting substituted polyisothianophthenes THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) 1988-07-06 EP disclosed