⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28091647 | 1.00 | — | — | |
| SCHEMBL27848682 | 1.00 | — | — | |
| SCHEMBL28613323 | 1.00 | — | — | |
| SCHEMBL30099104 | 0.87 | — | — | |
| SCHEMBL31609956 | 0.87 | — | — | |
| SCHEMBL28435334 | 0.87 | — | — | |
| SCHEMBL28418986 | 0.87 | — | — | |
| SCHEMBL6471971 | 0.87 | — | — | |
| SCHEMBL28441449 | 0.87 | — | — | |
| SCHEMBL1169745 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 592 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12557257-B2 | Matte-type electromagnetic interference shielding film comprising bio-based component and preparation method thereof | ASIA ELECTRONIC MATERIAL CO., LTD. (TW) | 2026-02-17 | — | — | US | claimed |
| CN-119765006-A | Manufacturing method of edge-emitting laser component | 厦门紫心半导体科技有限公司 | 2025-04-04 | — | — | CN | claimed |
| CN-119480828-A | High-performance alloy bump material and IC packaging process | 江苏晶度半导体科技有限公司 | 2025-02-18 | — | — | CN | claimed |
| CN-119381381-A | Three-dimensional stacked packaging structure and packaging method for FLASH chips | 贵州振华风光半导体股份有限公司 | 2025-01-28 | — | — | CN | claimed |
| CN-115915888-B | Preparation method of semiconductor refrigeration sheet and module | 比亚迪股份有限公司 | 2025-01-14 | — | — | CN | claimed |
| CN-222355119-U | Flash chip structure easy to weld | 信利光电股份有限公司 | 2025-01-14 | — | — | CN | claimed |
| CN-118899263-A | 2.5D packaging structure without through silicon via structure and packaging method | 华天科技（昆山）电子有限公司 | 2024-11-05 | — | — | CN | claimed |
| CN-118668210-A | Chip gold wire cleaning liquid, preparation method and application thereof | 浙江奥首材料科技有限公司 | 2024-09-20 | — | — | CN | claimed |
| EP-4409684-A1 | METHOD FOR SMOOTHING THE INNER SIDE OF A HIGH-FREQUENCY WAVEGUIDE | Friedrich-Alexander-Universität Erlangen-Nürnberg Körperschaft des öffentlichen Rechts (DE) | 2024-08-07 | — | — | EP | claimed |
| CN-221344732-U | Spraying device is retrieved to copper nickel gold thread gold salt | 博敏电子股份有限公司 | 2024-07-16 | — | — | CN | claimed |
| CN-102004940-A | High-density SIM (Subscriber Identity Module) card packaging element and production method thereof | TIANSHUI HUATIAN TECHNOLOGY CO | 2011-04-06 | — | — | CN | claimed |
| CN-101448362-B | Ultra-thin shielding film and circuit board capable of changing circuit impedance, and method for preparing same | GUANGZHOU TONGDE ELECTRONIC TECHNOLOGY CO LTD | 2010-10-06 | — | — | CN | claimed |
| WO-2010057933-A1 | INTEGRATED CIRCUIT DEVICE EQUIPPED WITH DIFFERENT CONNECTION MEANS | GEMALTO SA (FR) | 2010-05-27 | — | — | WO | claimed |
| CN-201479476-U | Single-face electro-nickel golden board manufacturing device | SHENZHEN SUN & LYNN CIRCUIT CO LTD | 2010-05-19 | — | — | CN | claimed |
| CN-101640978-A | Method and device for manufacturing single-side nickel-plated sheet | SHENZHEN SUN & LYNN CIRCUIT CO | 2010-02-03 | — | — | CN | claimed |
| CN-201332571-Y | Super-thin screened film capable of changing circuit impedance and circuit board | GUANGZHOU LIHE ELECTRONICS CO (CN) | 2009-10-21 | — | — | CN | claimed |
| CN-101448362-A | Ultra-thin shielding film and circuit board capable of changing circuit impedance, and method for preparing same | ZHI SU (CN) | 2009-06-03 | — | — | CN | claimed |
| JP-2009517861-A | — | — | 2009-04-30 | — | — | JP | claimed |
| CN-201210433-Y | Pasted sheet type thermistor | THINKING CHANGZHOU ELECTRONICS (CN) | 2009-03-18 | — | — | CN | claimed |
| WO-2007061216-A1 | METHOD FOR BONDING BETWEEN ELECTRICAL DEVICES USING ULTRASONIC VIBRATION | KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) | 2007-05-31 | — | — | WO | claimed |