SCHEMBL902477

SCHEMBL902477

CCCCCCc1nccn1CCCCCC

nearest known ligand 0.74

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TLR8 Q9NR97 2/20 0.59
ALDH1A1 P00352 2/20 0.53
POLB P06746 1/20 0.53
KMT2A Q03164 1/20 0.53
KCNH2 Q12809 4/20 0.42
TLR7 Q9NYK1 2/20 0.41
TBXAS1 P24557 1/20 0.41
AGTR1 P30556 1/20 0.40
AGTR2 P50052 1/20 0.40
TDP1 Q9NUW8 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5296044 1.00 TLR8 (0.59) TLR8ALDH1A1POLBKMT2AKCNH2
SCHEMBL4071947 1.00 TLR8 (0.59) TLR8ALDH1A1POLBKMT2AKCNH2
SCHEMBL2149023 1.00 TLR8 (0.59) TLR8ALDH1A1POLBKMT2AKCNH2
SCHEMBL5286463 1.00 TLR8 (0.59) TLR8ALDH1A1POLBKMT2AKCNH2
SCHEMBL11015818 1.00 TLR8 (0.59) TLR8ALDH1A1POLBKMT2AKCNH2
SCHEMBL9186379 1.00 TLR8 (0.59) TLR8ALDH1A1POLBKMT2AKCNH2
SCHEMBL5282914 1.00 TLR8 (0.59) TLR8ALDH1A1POLBKMT2AKCNH2
SCHEMBL5303316 1.00 TLR8 (0.59) TLR8ALDH1A1POLBKMT2AKCNH2
SCHEMBL5283349 1.00 TLR8 (0.59) TLR8ALDH1A1POLBKMT2AKCNH2
SCHEMBL5284183 1.00 TLR8 (0.59) TLR8ALDH1A1POLBKMT2AKCNH2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7314701-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2008-01-01 US claimed
WO-2024043165-A1 CURABLE COMPOSITION AND COMPOSITE MATERIAL 日東電工株式会社 2024-02-29 WO disclosed
CN-115910936-A Sealing resin sheet and electronic component device 日东电工株式会社 2023-04-04 CN disclosed
CN-115485820-A Method for producing cured resin sheet with electrode, and thermosetting resin sheet 日东电工株式会社 2022-12-16 CN disclosed
CN-115377016-A Sealing resin sheet and electronic component device 日东电工株式会社 2022-11-22 CN disclosed
WO-2022190898-A1 METHOD FOR MANUFACTURING CURED RESIN SHEET WITH ELECTRODE, CURED RESIN SHEET WITH ELECTRODE, AND THERMOSETTING RESIN SHEET 日東電工株式会社 2022-09-15 WO disclosed
CN-114174421-A Sealing resin sheet 日东电工株式会社 2022-03-11 CN disclosed
CN-114174424-A Sealing resin sheet 日东电工株式会社 2022-03-11 CN disclosed
CN-114144468-A Sealing resin sheet 日东电工株式会社 2022-03-04 CN disclosed
CN-114144469-A Sealing resin sheet 日东电工株式会社 2022-03-04 CN disclosed
CN-114096412-A Multilayer resin sheet for sealing 日东电工株式会社 2022-02-25 CN disclosed
CN-114080427-A Sealing resin sheet 日东电工株式会社 2022-02-22 CN disclosed
US-9074083-B2 Polyolefin resin composition for metal coating, and resin film and resin-coated metal material using the same NIPPON STEEL & SUMITOMO METAL CORPORATION (JP) 2015-07-07 US disclosed
EP-2621934-A1 ELECTROLYTE FORMULATIONS CONTAINING CYANO-ALKOXY-BORATE ANIONS Merck Patent GmbH (DE) 2013-08-07 EP disclosed
WO-2012041434-A1 ELECTROLYTE FORMULATIONS CONTAINING CYANO-ALKOXY-BORATE ANIONS MERCK PATENT GMBH (DE) 2012-04-05 WO disclosed
US-20080075962-A1 Polyolefin-Based Resin Composition for Metal Coating, and Resin Film and Resin-Coated Metal Material Using the Same NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) 2008-03-27 US disclosed
US-7314701-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2008-01-01 US disclosed
US-20050095527-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2005-05-05 US disclosed