SCHEMBL9066165

SCHEMBL9066165

C1COCOCOCCO1

nearest known ligand 0.60

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.60
TTR P02766 1/20 0.60
ALDH1A1 P00352 1/20 0.39
MEN1 O00255 1/20 0.38
KMT2A Q03164 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8446635 1.00 TSHR (0.60) TSHRTTRALDH1A1MEN1KMT2A
SCHEMBL337772 0.95
SCHEMBL9066256 0.95 TTR (0.67) TSHRTTRALDH1A1MEN1KMT2A
SCHEMBL7609756 0.95 TSHR (0.67) TSHRTTRALDH1A1MEN1KMT2A
SCHEMBL6239692 0.95 TTR (0.67) TSHRTTRALDH1A1MEN1KMT2A
SCHEMBL1246546 0.95
SCHEMBL4817267 0.95 TSHR (0.67) TSHRTTRALDH1A1MEN1KMT2A
Dioxane SCHEMBL978473 0.95 TTR (0.67) TSHRTTRALDH1A1MEN1KMT2A
Dioxane SCHEMBL22656875 0.95 TSHR (0.67) TSHRTTRALDH1A1MEN1KMT2A
SCHEMBL8749678 0.95 TTR (0.67) TSHRTTRALDH1A1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0584679-B1 Compatible polyphenylene ether/polyamide composition. MITSUBISHI CHEM CORP (JP) 1996-06-19 EP claimed
US-5352721-A Heat resistant, high impact strength molding materials; blend of polyphenylene ether, polyamide, acetal and Lewis acid MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1994-10-04 US claimed
EP-0584679-A1 Compatible polyphenylene ether/polyamide composition. MITSUBISHI CHEMICAL CORPORATION (JP) 1994-03-02 EP claimed
EP-0584679-B1 Compatible polyphenylene ether/polyamide composition. MITSUBISHI CHEM CORP (JP) 1996-06-19 EP disclosed
US-5352721-A Heat resistant, high impact strength molding materials; blend of polyphenylene ether, polyamide, acetal and Lewis acid MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1994-10-04 US disclosed
EP-0584679-A1 Compatible polyphenylene ether/polyamide composition. MITSUBISHI CHEMICAL CORPORATION (JP) 1994-03-02 EP disclosed