SCHEMBL90840

SCHEMBL90840

C=C(C)C(=O)OC1CC2CC1C1CC=CC21

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29546255 0.95 POLB (0.35)
SCHEMBL30358606 0.89
SCHEMBL15347376 0.89 POLB (0.38)
SCHEMBL24635989 0.86
SCHEMBL114981 0.85 CHRM2 (0.33)
SCHEMBL17836876 0.85 CHRM2 (0.33)
SCHEMBL18604001 0.85 CHRM2 (0.33)
SCHEMBL24978525 0.84
SCHEMBL24635993 0.82
SCHEMBL31661865 0.78 POLB (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8822563-B2 Curable resin composition and molded article FUJIFILM CORPORATION (JP) 2014-09-02 US disclosed
US-8822563-B2 Curable resin composition and molded article FUJIFILM CORPORATION (JP) 2014-09-02 US disclosed
US-20130131212-A1 CURABLE RESIN COMPOSITION AND MOLDED ARTICLE FUJIFILM CORPORATION (JP) 2013-05-23 US disclosed
US-20130131212-A1 CURABLE RESIN COMPOSITION AND MOLDED ARTICLE FUJIFILM CORPORATION (JP) 2013-05-23 US disclosed
US-8344045-B2 Ink composition, inkjet recording method, printed material, and process for producing molded printed material FUJIFILM CORPORATION (JP) 2013-01-01 US disclosed
US-8211508-B2 radiation curing ink cures with high sensitivity to form a high quality, durable image resistant to cracking, peeling and has excellent impact resistance, flexibility, and adhesion; cyclic monofunctional acrylic or N-vinyl monomers FUJIFILM CORPORATION (JP) 2012-07-03 US disclosed
US-8128843-B2 Photocurable composition, photocurable ink composition, process for producing photocured material, and inkjet recording method FUJIFILM CORPORATION (JP) 2012-03-06 US disclosed
US-20110242191-A1 INK COMPOSITION, INKJET RECORDING METHOD AND PROCESS FOR PRODUCING MOLDED PRINTED MATERIAL FUJIFILM CORPORATION (JP) 2011-10-06 US disclosed
US-20100239830-A1 INK COMPOSITION, INKJET RECORDING METHOD, PRINTED MATERIAL, AND PROCESS FOR PRODUCING MOLDED PRINTED MATERIAL FUJIFILM CORPORATION (JP) 2010-09-23 US disclosed
US-7713462-B2 Ink composition, inkjet recording method, printed material, and process for producing molded printed material FUJIFILM CORPORATION (JP) 2010-05-11 US disclosed
US-20090186163-A1 PHOTOCURABLE COMPOSITION, PHOTOCURABLE INK COMPOSITION, PROCESS FOR PRODUCING PHOTOCURED MATERIAL, AND INKJET RECORDING METHOD FUJIFILM CORPORATION (JP) 2009-07-23 US disclosed
US-20090087626-A1 INK COMPOSITION, INKJET RECORDING METHOD, PRINTED MATERIAL, AND PROCESS FOR PRODUCING MOLDED PRINTED MATERIAL FUJIFILM CORPORATION (JP) 2009-04-02 US disclosed
US-20090087627-A1 WHITE INK COMPOSITION, INKJET RECORDING METHOD, AND PRINTED MATERIAL FUJIFILM CORPORATION (JP) 2009-04-02 US disclosed
US-20080075882-A1 PROCESS FOR PRODUCING MOLDED PRINTED MATERIAL, AND MOLDED PRINTED MATERIAL FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed
US-20080075884-A1 radiation curing ink cures with high sensitivity to form a high quality, durable image resistant to cracking, peeling and has excellent impact resistance, flexibility, and adhesion; a polymerizable monomer and a polymerization initiator and comprising substantially no colorant FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed