SCHEMBL9100489

SCHEMBL9100489

[In+3].[S-2].[S-2].[Tl+]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30663367 0.82
SCHEMBL134095 0.82
SCHEMBL583291 0.82
Lithium Ion SCHEMBL3606416 0.67
Silver SCHEMBL1052053 0.67
SCHEMBL15094926 0.67
SCHEMBL9230917 0.67
SCHEMBL1438487 0.67
SCHEMBL5466470 0.67
Water SCHEMBL1662669 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10453620-B2 Perovskite composite structure WINBOND ELECTRONICS CORP. (TW) 2019-10-22 US claimed
US-20180240607-A1 PEROVSKITE COMPOSITE STRUCTURE WINBOND ELECTRONICS CORP. (TW) 2018-08-23 US claimed
US-5548461-A Arc suppressor MCDONNELL DOUGLAS CORPORATION (US) 1996-08-20 US claimed
US-10453620-B2 Perovskite composite structure WINBOND ELECTRONICS CORP. (TW) 2019-10-22 US disclosed
CN-108461632-A Perovskite composite structure 华邦电子股份有限公司 2018-08-28 CN disclosed
US-20180240607-A1 PEROVSKITE COMPOSITE STRUCTURE WINBOND ELECTRONICS CORP. (TW) 2018-08-23 US disclosed
CN-1473206-A Plasma electroplating 2004-02-04 CN disclosed
US-5548461-A Arc suppressor MCDONNELL DOUGLAS CORPORATION (US) 1996-08-20 US disclosed