SCHEMBL9101510

SCHEMBL9101510

CCO[Si](CCCCCOCCCCC1CCO1)(CCCCCOCCCCC1CCO1)CCCCCC1CCO1

nearest known ligand 0.50

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 1/20 0.50
ALDH1A1 P00352 2/20 0.36
TDP1 Q9NUW8 1/20 0.36
SPHK2 Q9NRA0 2/20 0.34
SPHK1 Q9NYA1 1/20 0.34
SMN1; SMN2 Q16637 1/20 0.31
TSHR P16473 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15253369 0.83 EPHX1 (0.47) EPHX1ALDH1A1TDP1SPHK2SPHK1
SCHEMBL31313174 0.81 EPHX1 (0.56) EPHX1ALDH1A1
SCHEMBL2472388 0.80 EPHX1 (0.61) EPHX1ALDH1A1TDP1SPHK2SPHK1
SCHEMBL3382033 0.80 EPHX1 (0.61) EPHX1ALDH1A1TDP1SPHK2SPHK1
SCHEMBL3379496 0.80 EPHX1 (0.61) EPHX1ALDH1A1TDP1SPHK2SPHK1
SCHEMBL250637 0.80 EPHX1 (0.61) EPHX1ALDH1A1TDP1SPHK2SPHK1
SCHEMBL251209 0.80 EPHX1 (0.61) EPHX1ALDH1A1TDP1SPHK2SPHK1
SCHEMBL3381884 0.78 EPHX1 (0.58) EPHX1ALDH1A1TDP1SPHK2SPHK1
SCHEMBL9101314 0.77 EPHX1 (0.55) EPHX1ALDH1A1
SCHEMBL23581902 0.76 EPHX1 (0.46) EPHX1ALDH1A1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10162260-B2 Photosensitive resin composition, protective film, and liquid crystal display element CHI MEI CORPORATION (TW) 2018-12-25 US disclosed
US-9851638-B2 Photosensitive polysiloxane composition and uses thereof CHI MEI CORPORATION (TW) 2017-12-26 US disclosed
US-20170168390-A1 PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT CHI MEI CORPORATION (TW) 2017-06-15 US disclosed
US-20170023860-A1 PHOTOSENSITIVE POLYSILOXANE COMPOSITION AND USES THEREOF CHI MEI CORP (TW) 2017-01-26 US disclosed
US-9541832-B2 Photosensitive resin composition, protective film and element having the same CHI MEI CORPORATION (TW) 2017-01-10 US disclosed
US-9507261-B2 Photosensitive composition, protective film, and element having the protective film CHI MEI CORPORATION (TW) 2016-11-29 US disclosed
US-9395627-B2 Positive photosensitive resin composition and method for forming pattern by using the same CHI MEI CORPORATION 2016-07-19 US disclosed
US-9389509-B2 Photosensitive polysiloxane composition, protecting film and element having the protecting film CHI MEI CORPORATION (TW) 2016-07-12 US disclosed
US-9298091-B2 Photosensitive resin composition and uses thereof CHI MEI CORPORATION (TW) 2016-03-29 US disclosed
US-20150378256-A1 PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM AND ELEMENT HAVING THE SAME CHI MEI CORPORATION (TW) 2015-12-31 US disclosed
US-8722755-B2 Photosensitive resin composition and uses thereof CHI MEI CORPORATION (TW) 2014-05-13 US disclosed
US-20130310497-A1 PHOTO-CURING POLYSILOXANE COMPOSITION AND APPLICATIONS THEREOF CHI MEI CORPORATION (TW) 2013-11-21 US disclosed
US-20130299755-A1 PHOTOSENSITIVE RESIN COMPOSITION FOR A COLOR FILTER AND USES THEREOF CHI MEI CORPORATION (TW) 2013-11-14 US disclosed
US-20130280541-A1 PHOTO-CURING POLYSILOXANE COMPOSITION AND APPLICATION THEREOF CHI MEI CORPORATION (TW) 2013-10-24 US disclosed
US-20130260108-A1 PHOTO-CURING POLYSILOXAN COMPOSITION AND APPLICATIONS THEREOF CHI MEI CORPORATION (TW) 2013-10-03 US disclosed
US-8546061-B2 Photo-curing polysiloxane composition and protective film formed from the same CHI MEI CORPORATION (TW) 2013-10-01 US disclosed
US-20130245150-A1 PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2013-09-19 US disclosed
US-20130144005-A1 PHOTO-CURING POLYSILOXANE COMPOSITION AND APPLICATION THEREOF CHI MEI CORPORATION (TW) 2013-06-06 US disclosed
US-20130142966-A1 BLUE PHOTOSENSITIVE RESIN COMPOSITION FOR COLOR FILTERS AND USES THEREOF CHI MEI CORPORATION (TW) 2013-06-06 US disclosed
US-20120141936-A1 PHOTO-CURING POLYSILOXANE COMPOSITION AND PROTECTIVE FILM FORMED FROM THE SAME CHI MEI CORPORATION (TW) 2012-06-07 US disclosed