⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4057990 | 0.89 | — | — | |
| SCHEMBL56970 | 0.89 | — | — | |
| Water SCHEMBL28985406 | 0.80 | — | — | |
| Methane SCHEMBL9815400 | 0.80 | — | — | |
| SCHEMBL5031638 | 0.80 | — | — | |
| SCHEMBL25386911 | 0.80 | — | — | |
| SCHEMBL911267 | 0.80 | — | — | |
| SCHEMBL912326 | 0.80 | — | — | |
| SCHEMBL911988 | 0.80 | — | — | |
| Ethane SCHEMBL28466457 | 0.73 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 135 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119776089-A | Cleaning compositions and methods of use thereof | 富士胶片电子材料美国有限公司 | 2025-04-08 | — | — | CN | claimed |
| CN-115397572-B | Cleaning compositions and methods of use thereof | 富士胶片电子材料美国有限公司 | 2024-12-31 | — | — | CN | claimed |
| CN-118414401-A | Polishing composition and method of use | 富士胶片电子材料美国有限公司 | 2024-07-30 | — | — | CN | claimed |
| EP-3486274-B1 | METHOD FOR PRODUCING COMPOSITE MATERIAL AND COMPOSITE MATERIAL | MITSUBISHI GAS CHEMICAL CO (JP) | 2026-04-01 | — | — | EP | disclosed |
| EP-4656668-A1 | INSULATING MATERIAL HAVING HIGH WITHSTAND VOLTAGE, AND INSULATING MOLDED ARTICLE HAVING HIGH WITHSTAND VOLTAGE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2025-12-03 | — | — | EP | disclosed |
| EP-4159788-B1 | POLYAMIDE RESIN, POLYAMIDE RESIN COMPOSITION, AND MOLDED ARTICLE | MITSUBISHI GAS CHEMICAL CO (JP) | 2025-07-16 | — | — | EP | disclosed |
| CN-119776089-A | Cleaning compositions and methods of use thereof | 富士胶片电子材料美国有限公司 | 2025-04-08 | — | — | CN | disclosed |
| CN-115397572-B | Cleaning compositions and methods of use thereof | 富士胶片电子材料美国有限公司 | 2024-12-31 | — | — | CN | disclosed |
| US-12162985-B2 | Polyamide resin | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2024-12-10 | — | — | US | disclosed |
| EP-3689590-B1 | LAYERED TUBE | UBE CORP (JP) | 2024-08-28 | — | — | EP | disclosed |
| WO-2024157584-A1 | INSULATING MATERIAL HAVING HIGH WITHSTAND VOLTAGE, AND INSULATING MOLDED ARTICLE HAVING HIGH WITHSTAND VOLTAGE | 三菱瓦斯化学株式会社 | 2024-08-02 | — | — | WO | disclosed |
| EP-2562203-A1 | POLYAMIDE COMPOUND | Mitsubishi Gas Chemical Company, Inc. (JP) | 2013-02-27 | — | — | EP | disclosed |
| US-20130041128-A1 | POLYAMIDE COMPOUND | MITSUBISHI GAS CHEMICAL COMPANY,INC. (JP) | 2013-02-14 | — | — | US | disclosed |
| US-20120302723-A1 | POLYAMIDE COMPOUND | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2012-11-29 | — | — | US | disclosed |
| EP-2520604-A1 | POLYAMIDE COMPOUND | Mitsubishi Gas Chemical Company, Inc. (JP) | 2012-11-07 | — | — | EP | disclosed |
| CN-101547930-B | Compound and composition containing same | KURARAY MEDICAL INC | 2012-09-19 | — | — | CN | disclosed |
| US-20110003100-A1 | POLYESTER COMPOSITION AND POLYESTER MOLDED ARTICLE COMPRISING THE SAME | TOYO BOSEKI KABUSHIKI KAISHA (JP) | 2011-01-06 | — | — | US | disclosed |
| CN-101547930-A | Novel compound, composition containing same, and method for producing polymerizable amide | KURARAY MEDICAL INC (JP) | 2009-09-30 | — | — | CN | disclosed |
| US-6308778-B1 | Compositions and methods of catalyzing the rate of iron reduction during acid treatment of wells | BJ SERVICES COMPANY | 2001-10-30 | — | — | US | disclosed |
| US-5063997-A | Using phosphinic acid and copper compound catalyst | NOWSCO WELL SERVICE LTD. (CA) | 1991-11-12 | — | — | US | disclosed |