SCHEMBL9166271

SCHEMBL9166271

COCC(O)COC(C)COC(C)COC(C)COC(C)COC(C)COC(C)CO

nearest known ligand 0.38

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.38
MAPT P10636 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28648440 1.00 TDP1 (0.38) TDP1MAPT
SCHEMBL98126 1.00 TDP1 (0.38) TDP1MAPT
SCHEMBL28649335 1.00 TDP1 (0.38) TDP1MAPT
SCHEMBL28643738 1.00 TDP1 (0.38) TDP1MAPT
SCHEMBL1575496 1.00 TDP1 (0.38) TDP1MAPT
SCHEMBL28653627 1.00 TDP1 (0.38) TDP1MAPT
SCHEMBL28649329 1.00 TDP1 (0.38) TDP1MAPT
SCHEMBL31016048 1.00 TDP1 (0.38) TDP1MAPT
SCHEMBL97393 0.96 TDP1 (0.36) TDP1MAPT
SCHEMBL32680147 0.87 TDP1 (0.44) TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12331228-B2 Photocurable resin composition, cured product, and laminated body THREEBOND CO., LTD. (JP) 2025-06-17 US claimed
US-11560475-B2 Photocurable resin composition, cured product, and laminate THREEBOND CO., LTD. (JP) 2023-01-24 US claimed
EP-4714983-A1 PHOTOCURABLE RESIN COMPOSITION AND CURED OBJECT FORMED THEREFROM ThreeBond Co., Ltd. (JP) 2026-03-25 EP disclosed
US-20250329859-A1 APPLICATION SYSTEM AESC JAPAN LTD (JP) 2025-10-23 US disclosed
US-12331228-B2 Photocurable resin composition, cured product, and laminated body THREEBOND CO., LTD. (JP) 2025-06-17 US disclosed
WO-2025052775-A1 PHOTOCURABLE RESIN COMPOSITION 株式会社スリーボンド 2025-03-13 WO disclosed
WO-2025013728-A1 ADHESIVE BODY AND METHOD FOR PRODUCING SAME 株式会社レゾナック 2025-01-16 WO disclosed
WO-2025013726-A1 ADHESIVE COMPOSITION 株式会社レゾナック 2025-01-16 WO disclosed
WO-2024237158-A1 PHOTOCURABLE RESIN COMPOSITION AND CURED OBJECT FORMED THEREFROM 株式会社スリーボンド 2024-11-21 WO disclosed
WO-2023219111-A1 ADHESIVE SET, BONDED BODY AND METHOD FOR PRODUCING SAME 株式会社レゾナック 2023-11-16 WO disclosed
WO-2023219109-A1 ADHESIVE SET, ADHESIVE BODY, AND MANUFACTURING METHOD THEREFOR 株式会社レゾナック 2023-11-16 WO disclosed
US-20150368499-A1 PHOTO CURABLE RESIN COMPOSITION, IMAGING DISPLAY DEVICE AND PRODUCTION METHOD THEREOF HITACHI CHEMICAL COMPANY, LTD. 2015-12-24 US disclosed
US-9150706-B2 Photo curable resin composition, imaging display device and production method thereof HITACHI CHEMICAL COMPANY, LTD. (JP) 2015-10-06 US disclosed
US-20150056417-A1 ADHESIVE SHEET FOR IMAGE DISPLAY DEVICE, METHOD FOR MANUFACTURING IMAGE DISPLAY DEVICE, AND IMAGE DISPLAY DEVICE HITACHI CHEMICAL COMPANY, LTD. (JP) 2015-02-26 US disclosed
US-20130286604-A1 PHOTO CURABLE RESIN COMPOSITION, IMAGING DISPLAY DEVICE AND PRODUCTION METHOD THEREOF HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-10-31 US disclosed
US-20130224425-A1 PRESSURE-SENSITIVE ADHESIVE SHEET FOR IMAGE DISPLAY DEVICE, METHOD FOR PRODUCING IMAGE DISPLAY DEVICE AND IMAGE DISPLAY DEVICE HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-08-29 US disclosed
EP-0502576-B1 Application of a plastic dispersion as coating for inorganic and organic particles DSM NV (NL) 1995-05-03 EP disclosed
US-5268197-A Using polymer of vinyl monomer, unsaturated ester and phosphorous compound STAMICARBON B.V. 1993-12-07 US disclosed
EP-0502576-A1 Application of a plastic dispersion as coating for inorganic and organic particles DSM N.V. (NL) 1992-09-09 EP disclosed
US-4101490-A Process for preparing aqueous emulsions of addition polymers with built-in emulsifier SYNRES INTERNATIONAL B.V. (NL) 1978-07-18 US disclosed