⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL39952 | 0.95 | — | — | |
| SCHEMBL9694230 | 0.95 | — | — | |
| SCHEMBL7894732 | 0.91 | — | — | |
| SCHEMBL4385577 | 0.91 | — | — | |
| Water SCHEMBL5555452 | 0.91 | — | — | |
| Hydrochloric Acid SCHEMBL1093323 | 0.91 | — | — | |
| Bromide SCHEMBL1835600 | 0.91 | — | — | |
| SCHEMBL7893787 | 0.91 | — | — | |
| SCHEMBL2256872 | 0.91 | — | — | |
| Iodide SCHEMBL1836504 | 0.91 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8308858-B2 | Electroless deposition process on a silicon contact | APPLIED MATERIALS, INC. (US) | 2012-11-13 | — | — | US | claimed |
| US-20100107927-A1 | ELECTROLESS DEPOSITION PROCESS ON A SILICON CONTACT | APPLIED MATERIALS, INC. | 2010-05-06 | — | — | US | claimed |
| US-7659203-B2 | Electroless deposition process on a silicon contact | APPLIED MATERIALS, INC. (US) | 2010-02-09 | — | — | US | claimed |
| US-20060264043-A1 | Electroless deposition process on a silicon contact | APPLIED MATERIALS, INC. | 2006-11-23 | — | — | US | claimed |
| WO-2006102318-A2 | ELECTROLESS DEPOSITION PROCESS ON A CONTACT CONTAINING SILICON OR SILICIDE | APPLIED MATERIALS, INC. (US) | 2006-09-28 | — | — | WO | claimed |
| WO-2023091370-A1 | EXCIPIENT COMPOUNDS FOR BIOPOLYMER FORMULATIONS | COMERA LIFE SCIENCES, INC. (US) | 2023-05-25 | — | — | WO | disclosed |
| US-20230027396-A1 | EXCIPIENT COMPOUNDS FOR BIOPOLYMER FORMULATIONS | COMERA LIFE SCIENCES, INC. | 2023-01-26 | — | — | US | disclosed |
| EP-4065166-A1 | EXCIPIENT COMPOUNDS FOR BIOPOLYMER FORMULATIONS | Comera Life Sciences, Inc. (US) | 2022-10-05 | — | — | EP | disclosed |
| WO-2021108427-A1 | EXCIPIENT COMPOUNDS FOR BIOPOLYMER FORMULATIONS | REFORM BIOLOGICS, LLC (US) | 2021-06-03 | — | — | WO | disclosed |
| EP-2475000-B1 | PROCESSING AGENT COMPOSITION FOR SEMICONDUCTOR SURFACE AND METHOD FOR PROCESSING SEMICONDUCTOR SURFACE USING SAME | WAKO PURE CHEM IND LTD (JP) | 2015-07-01 | — | — | EP | disclosed |
| US-9034810-B2 | Processing agent composition for semiconductor surface and method for processing semiconductor surface using same | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2015-05-19 | — | — | US | disclosed |
| US-8828918-B2 | Semiconductor surface treating agent composition and method for treating semiconductor surface using the semiconductor surface treating agent composition | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2014-09-09 | — | — | US | disclosed |
| US-20100107927-A1 | ELECTROLESS DEPOSITION PROCESS ON A SILICON CONTACT | APPLIED MATERIALS, INC. | 2010-05-06 | — | — | US | disclosed |
| US-7659203-B2 | Electroless deposition process on a silicon contact | APPLIED MATERIALS, INC. (US) | 2010-02-09 | — | — | US | disclosed |
| US-20060264043-A1 | Electroless deposition process on a silicon contact | APPLIED MATERIALS, INC. | 2006-11-23 | — | — | US | disclosed |
| US-20060246217-A1 | Electroless deposition process on a silicide contact | APPLIED MATERIALS, INC. | 2006-11-02 | — | — | US | disclosed |
| US-7128976-B2 | Composition for film formation, method of film formation, and silica-based film | JSR CORPORATION (JP) | 2006-10-31 | — | — | US | disclosed |
| WO-2006102318-A2 | ELECTROLESS DEPOSITION PROCESS ON A CONTACT CONTAINING SILICON OR SILICIDE | APPLIED MATERIALS, INC. (US) | 2006-09-28 | — | — | WO | disclosed |
| US-20040029753-A1 | Resist stripping liquid containing fluorine compound | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2004-02-12 | — | — | US | disclosed |
| US-20030091838-A1 | Composition for film formation, method of film formation, and silica-based film | JSR CORPORATION (JP) | 2003-05-15 | — | — | US | disclosed |