Known targets — ChEMBL curated mechanism
The experimentally established mechanism targets of Monoethanolamine. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Monoethanolamine SCHEMBL5943538 | 1.00 | — | — | |
| Monoethanolamine SCHEMBL11799449 | 1.00 | — | — | |
| Monoethanolamine SCHEMBL7554334 | 1.00 | TSHR (0.89) | — | |
| Monoethanolamine SCHEMBL7071195 | 0.95 | — | — | |
| Monoethanolamine SCHEMBL1331364 | 0.94 | — | — | |
| Monoethanolamine SCHEMBL1332111 | 0.94 | — | — | |
| Monoethanolamine SCHEMBL29663853 | 0.94 | — | — | |
| Monoethanolamine SCHEMBL1644 | 0.94 | — | — | |
| Monoethanolamine SCHEMBL14675689 | 0.94 | TSHR (1.00) | — | |
| Monoethanolamine SCHEMBL10941117 | 0.94 | TSHR (1.00) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 249 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12557622-B2 | Method for fabricating a semiconductor device with a composite barrier structure | NANYA TECHNOLOGY CORPORATION (TW) | 2026-02-17 | — | — | US | claimed |
| US-12341054-B2 | Method for fabricating semiconductor device with chelating agent | NANYA TECHNOLOGY CORPORATION (TW) | 2025-06-24 | — | — | US | claimed |
| CN-118143443-A | Preparation method of micro-nano composite texture extreme wettability surface for complex curved surface | 山东大学 | 2024-06-07 | — | — | CN | claimed |
| CN-117620519-A | Soldering flux for laser soldering tin wire and preparation method thereof | 广州汉源微电子封装材料有限公司 | 2024-03-01 | — | — | CN | claimed |
| CN-117524975-A | Method for manufacturing semiconductor device | 南亚科技股份有限公司 | 2024-02-06 | — | — | CN | claimed |
| CN-117431603-A | Preparation method of black porous metal, black porous metal and application of black porous metal | 重庆大学 | 2024-01-23 | — | — | CN | claimed |
| CN-116895517-A | Semiconductor device and method for manufacturing the same | 南亚科技股份有限公司 | 2023-10-17 | — | — | CN | claimed |
| US-20230317508-A1 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH PRE-CLEANING TREATMENT | NANYA TECHNOLOGY CORPORATION (TW) | 2023-10-05 | — | — | US | claimed |
| US-20230317514-A1 | SEMICONDUCTOR DEVICE WITH COMPOSITE BARRIER STRUCTURE AND METHOD FOR FABRICATING THE SAME | NANYA TECHNOLOGY CORPORATION (TW) | 2023-10-05 | — | — | US | claimed |
| CN-110865103-B | Photoelectrochemical analysis method for selectively detecting pesticide atrazine | 山西大学 | 2021-02-02 | — | — | CN | claimed |
| US-20060237392-A1 | Polymer remover | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2006-10-26 | — | — | US | claimed |
| WO-2006102318-A2 | ELECTROLESS DEPOSITION PROCESS ON A CONTACT CONTAINING SILICON OR SILICIDE | APPLIED MATERIALS, INC. (US) | 2006-09-28 | — | — | WO | claimed |
| EP-1701218-A2 | Polymer remover | Rohm and Haas Electronic Materials LLC (US) | 2006-09-13 | — | — | EP | claimed |
| CN-1759472-A | Process for production of etching or cleaning fluids | DAIKIN IND LTD (JP) | 2006-04-12 | — | — | CN | claimed |
| US-20050014667-A1 | Aqueous fluoride compositions for cleaning semiconductor devices | EKC TECHNOLOGY, K.K. (JP) | 2005-01-20 | — | — | US | claimed |
| WO-2005004598-A2 | INSECT REPELLENT, METHOD FOR MANUFACTURING AND ITS USAGE | OY FAKTARATE AB (FI) | 2005-01-20 | — | — | WO | claimed |
| WO-2004094581-A1 | AQUEOUS FLUORIDE COMPOSITIONS FOR CLEANING SEMICONDUCTOR DEVICES | EKC TECHNOLOGY, INC. (US) | 2004-11-04 | — | — | WO | claimed |
| US-20040009883-A1 | Resist stripping composition | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2004-01-15 | — | — | US | claimed |
| US-6323169-B1 | AQUEOUS STRIPPING COMPOSITION CONTAINING OXIDIZING AGENT, CHELATING AGENT, WATER SOLUBLE FLUORINE COMPOUND SELECTED FROM AMMONIUM FLUORIDE, ACID AMMONIUM FLUORIDE, MONOETHANOLAMINE FLUORIDE, AND TETRAMETHYLAMMONIUM FLUORIDE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2001-11-27 | — | — | US | claimed |
| EP-1035446-A2 | Resist stripping composition and process for stripping resist | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2000-09-13 | — | — | EP | claimed |