SCHEMBL927673

SCHEMBL927673

O=C(O)C(CCO)c1ccc(O)cc1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 5/20 0.46
ESR2 Q92731 4/20 0.46
SRC P12931 1/20 0.44
LMNA P02545 3/20 0.42
HSD17B10 Q99714 2/20 0.42
GRM8 O00222 1/20 0.41
GRM4 Q14833 1/20 0.41
SLC7A5 Q01650 1/20 0.40
ALDH1A1 P00352 3/20 0.40
L3MBTL1 Q9Y468 3/20 0.40
GAA P10253 2/20 0.40
NAALAD2 Q9Y3Q0 1/20 0.40
TDP1 Q9NUW8 3/20 0.39
POLB P06746 2/20 0.39
KDM4E B2RXH2 1/20 0.39
ABL1 P00519 1/20 0.39
ALPI P09923 1/20 0.39
ALPG P10696 1/20 0.39
APEX1 P27695 1/20 0.39
CASP3 P42574 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9702510 0.90 ESR1 (0.50) ESR1ESR2SRCLMNAHSD17B10
SCHEMBL7087165 0.83 ESR1 (0.48) ESR1ESR2SRCLMNAHSD17B10
SCHEMBL819393 0.83 CYP2C19 (0.55) SRCLMNAALDH1A1GAAPOLB
SCHEMBL7899585 0.83 CYP2C19 (0.55) SRCLMNAALDH1A1GAAPOLB
SCHEMBL7909074 0.83 CYP2C19 (0.55) SRCLMNAALDH1A1GAAPOLB
SCHEMBL23174852 0.82 NAALAD2 (0.53) ESR1ESR2SRCLMNAHSD17B10
SCHEMBL7907447 0.82 PTGS1 (0.41) ALDH1A1L3MBTL1GAATDP1POLB
SCHEMBL21357582 0.82 ESR1 (0.44) ESR1ESR2LMNAHSD17B10GRM8
SCHEMBL633268 0.82 ESR1 (0.49) ESR1ESR2SRCLMNAHSD17B10
SCHEMBL7912554 0.82 PTGS1 (0.41) ALDH1A1L3MBTL1GAATDP1POLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 67 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118019780-A Polyimide, polyimide precursor, composition, and method for producing polyimide 富士胶片株式会社 2024-05-10 CN disclosed
WO-2023054222-A1 COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, STRUCTURE, AND DEVICE 富士フイルム株式会社 2023-04-06 WO disclosed
WO-2023054221-A1 POLYIMIDE, POLYIMIDE PRECURSOR, COMPOSITION, AND PRODUCTION METHOD FOR POLYIMIDE 富士フイルム株式会社 2023-04-06 WO disclosed
US-10868329-B2 All solid state secondary battery, solid electrolyte composition used therefor, electrode sheet for battery using the same, and method for manufacturing electrode sheet for battery and all solid state secondary battery FUJIFILM CORPORATION (JP) 2020-12-15 US disclosed
EP-3493317-A1 SOLID ELECTROLYTE COMPOSITION, SOLID-ELECTROLYTE-CONTAINING SHEET AND ALL-SOLID-STATE SECONDARY BATTERY, PRODUCTION METHOD FOR SOLID-ELECTROLYTE-CONTAINING SHEET AND ALL-SOLID-STATE SECONDARY BATTERY, SEGMENTED POLYMER, AND NON-AQUEOUS-SOLVENT DISPERSION OF POLYMER AND SEGMENTED POLYMER Fujifilm Corporation (JP) 2019-06-05 EP disclosed
US-20190157710-A1 SOLID ELECTROLYTE COMPOSITION, SOLID ELECTROLYTE-CONTAINING SHEET, ALL-SOLID STATE SECONDARY BATTERY, METHODS FOR MANUFACTURING SOLID ELECTROLYTE-CONTAINING SHEET AND ALL-SOLID STATE SECONDARY BATTERY, SEGMENTED POLYMER, AND NON-AQUEOUS SOLVENT DISPERSION OF POLYMER AND SEGMENTED POLYMER FUJIFILM CORPORATION (JP) 2019-05-23 US disclosed
CN-105580186-B Solid electrolyte composition, the adhesive of solid state secondary battery, battery electrode sheet and solid state secondary battery using them 富士胶片株式会社 2018-02-06 CN disclosed
US-20170301949-A1 ALL SOLID STATE SECONDARY BATTERY, SOLID ELECTROLYTE COMPOSITION USED THEREFOR, ELECTRODE SHEET FOR BATTERY USING THE SAME, AND METHOD FOR MANUFACTURING ELECTRODE SHEET FOR BATTERY AND ALL SOLID STATE SECONDARY BATTERY FUJIFILM CORPORATION (JP) 2017-10-19 US disclosed
US-20170288144-A1 ALL SOLID STATE SECONDARY BATTERY, SOLID ELECTROLYTE COMPOSITION USED THEREFOR, ELECTRODE SHEET FOR BATTERY, AND METHOD FOR MANUFACTURING ELECTRODE SHEET FOR BATTERY AND ALL SOLID STATE SECONDARY BATTERY FUJIFILM CORPORATION (JP) 2017-10-05 US disclosed
CN-103703417-B Photosensitive composite, original edition of lithographic printing plate, the manufacture method of polyurethane and polyurethane 富士胶片株式会社 2017-07-14 CN disclosed
US-6844137-B2 Capable of forming a planographic plate having excellent plate life; capable of directly being engraved from digital data of a computer or like by recording with solid state laser and a semiconductor laser irradiating infrared rays FUJI PHOTO FILM CO., LTD. (JP) 2005-01-18 US disclosed
US-6727044-B1 LASER SCANNING LITHOGRAPHIC PRINTING ORIGINAL PLATE WHICH CAN PROVIDE A PRINTING PLATE HAVING A SUFFICIENTLY LONG PRESS LIFE EVEN BY HIGH-SPEED SCAN EXPOSURE AND CAUSES LITTLE FLUCTUATION IN THE PRINTING PERFORMANCE OF THE PRINTING PLATE FUJI PHOTO FILM CO., LTD. (JP) 2004-04-27 US disclosed
US-20020086238-A1 Capable of forming a planographic plate having excellent plate life; capable of directly being engraved from digital data of a computer or like by recording with solid state laser and a semiconductor laser irradiating infrared rays FUJIFILM CORPORATION (JP) 2002-07-04 US disclosed
EP-1136255-A2 Image recording material FUJI PHOTO FILM CO., LTD. (JP) 2001-09-26 EP disclosed
EP-0949540-A1 Method for producing lithographic printing plate suitable for laser scan exposure, and photopolymerizable composition FUJI PHOTO FILM CO., LTD (JP) 1999-10-13 EP disclosed
US-5316885-A THERMAL TRANSFER PRINTING KAO CORPORATION (JP) 1994-05-31 US disclosed
US-5294490-A Having a shell of endcapped polyiso(thio)urethanes having dissociable linkages KAO CORPORATION (JP) 1994-03-15 US disclosed
EP-0472106-B1 Pulverulent ink and printing methods KAO CORP (JP) 1994-02-16 EP disclosed
EP-0514843-A1 Encapsulated toner for heat and-pressure fixing Kao Corporation (JP) 1992-11-25 EP disclosed
EP-0472106-A2 Pulverulent ink and printing methods KAO CORPORATION (JP) 1992-02-26 EP disclosed