⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7034647 | 0.98 | — | — | |
| SCHEMBL8418188 | 0.87 | — | — | |
| Methane SCHEMBL1532540 | 0.85 | — | — | |
| SCHEMBL8184593 | 0.84 | — | — | |
| SCHEMBL161567 | 0.78 | — | — | |
| SCHEMBL9422223 | 0.77 | — | — | |
| SCHEMBL7595871 | 0.76 | — | — | |
| SCHEMBL28301043 | 0.76 | MEN1 (0.30) | — | |
| SCHEMBL3627316 | 0.74 | — | — | |
| Methane SCHEMBL7051666 | 0.73 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 145 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3613808-B1 | HIGH DIELECTRIC INSULATING SILICONE RUBBER COMPOSITION AND ELECTRIC FIELD RELAXATION LAYER | SHINETSU CHEMICAL CO (JP) | 2024-06-19 | — | — | EP | disclosed |
| CN-111205788-B | Anisotropic film and method for producing anisotropic film | 信越化学工业株式会社 | 2024-06-07 | — | — | CN | disclosed |
| WO-2024117187-A1 | CONTAINER FOR STORING ADDITION-CURING LIQUID SILICONE COMPOSITION | 信越化学工業株式会社 | 2024-06-06 | — | — | WO | disclosed |
| US-20240158673-A1 | CO-MODIFIED ORGANOPOLYSILOXANE AND CURABLE ORGANOPOLYSILOXANE COMPOSITION INCLUDING SAME | DOW TORAY CO., LTD. (JP) | 2024-05-16 | — | — | US | disclosed |
| EP-3517576-B1 | TRANSPARENT LIQUID SILICONE RUBBER COMPOSITION | SHINETSU CHEMICAL CO (JP) | 2024-04-03 | — | — | EP | disclosed |
| US-11787943-B2 | Curable silicone composition and optical semiconductor device | DOW SILICONES CORPORATION (US) | 2023-10-17 | — | — | US | disclosed |
| US-20230295429-A1 | CURABLE SILICONE COMPOSITION AND CURED PRODUCT OF SAME | DOW TORAY CO., LTD. (JP) | 2023-09-21 | — | — | US | disclosed |
| WO-2023112736-A1 | CURABLE LIQUID SILICONE COMPOSITION AND CURING METHOD FOR SAID COMPOSITION | 信越化学工業株式会社 | 2023-06-22 | — | — | WO | disclosed |
| EP-4194512-A1 | CURABLE SILICONE COMPOSITION AND CURED PRODUCT OF SAME | Dow Toray Co., Ltd. (JP) | 2023-06-14 | — | — | EP | disclosed |
| EP-4186953-A1 | ANTI-SULFURIZATION COATING MATERIAL, CURED PRODUCT THEREOF, AND ELECTRONIC DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-05-31 | — | — | EP | disclosed |
| US-6552096-B2 | As sponge to be used as an shock-absorbing, or cushioning, heat-insulating or heat-storing materials; heat resistance, weather resistance, electric insulating properties, lightweight sponge | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-04-22 | — | — | US | disclosed |
| EP-1006145-B1 | Addition-curable silicone rubber composition | SHINETSU CHEMICAL CO (JP) | 2003-02-26 | — | — | EP | disclosed |
| US-6425600-B1 | Silicone rubber composition for coating air bags | SHIN-ETSU CORPORATION (JP) | 2002-07-30 | — | — | US | disclosed |
| US-20020014712-A1 | Hollow filler-containing silicone rubber and method of production | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-02-07 | — | — | US | disclosed |
| US-20020016019-A1 | PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE PACKAGE AND ORGANOPOLYSILOXANE COMPOSITION USED THEREFOR | IKENO MASAYUKI (JP) | 2002-02-07 | — | — | US | disclosed |
| US-6274658-B1 | ACRYLATED RESIN; USING PLATINUM CATALYST; STORAGE STABILITY; FAST CURING | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-08-14 | — | — | US | disclosed |
| EP-1108764-A2 | Silicone rubber composition for coating air bags | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-06-20 | — | — | EP | disclosed |
| EP-1006145-A1 | Addition-curable silicone rubber composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-06-07 | — | — | EP | disclosed |
| EP-0939440-A2 | Process for producing semiconductor device package and organopolysiloxane composition used therefor | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1999-09-01 | — | — | EP | disclosed |
| US-4755577-A | Composition for coating optical communication glass fiber | TORAY SILICONE CO., LTD. (JP) | 1988-07-05 | — | — | US | disclosed |