SCHEMBL931247

SCHEMBL931247

C=C[Si](C[Si](C=C)(OC)OC)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2991960 0.86
SCHEMBL1271215 0.86
SCHEMBL13089364 0.84
SCHEMBL308366 0.84
SCHEMBL930678 0.81
SCHEMBL143500 0.79
SCHEMBL15015536 0.78
SCHEMBL12898522 0.78
SCHEMBL10298089 0.77
SCHEMBL4081159 0.77

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2272878-B1 Coupled polymers and manufacturing method thereof TSRC CORP (TW) 2013-12-18 EP claimed
US-8481649-B2 Coupled polymers and manufacturing method thereof TSRC CORPORATION (TW) 2013-07-09 US claimed
US-20110009588-A1 COUPLED POLYMERS AND MANUFACTURING METHOD THEREOF TSRC CORPORATION (TW) 2011-01-13 US claimed
EP-2272878-A1 Coupled polymers and manufacturing method thereof TSRC Corporation (TW) 2011-01-12 EP claimed
EP-2272878-B1 Coupled polymers and manufacturing method thereof TSRC CORP (TW) 2013-12-18 EP disclosed
US-8481649-B2 Coupled polymers and manufacturing method thereof TSRC CORPORATION (TW) 2013-07-09 US disclosed
CN-102212196-B Coupled copolymer and method for producing the same TSRC CORP 2013-03-06 CN disclosed
US-20110042789-A1 MATERIAL FOR CHEMICAL VAPOR DEPOSITION, SILICON-CONTAINING INSULATING FILM AND METHOD FOR PRODUCTION OF THE SILICON-CONTAINING INSULATING FILM JSR CORPORATION (JP) 2011-02-24 US disclosed
US-20110009588-A1 COUPLED POLYMERS AND MANUFACTURING METHOD THEREOF TSRC CORPORATION (TW) 2011-01-13 US disclosed
EP-2272878-A1 Coupled polymers and manufacturing method thereof TSRC Corporation (TW) 2011-01-12 EP disclosed
EP-2264219-A1 MATERIAL FOR CHEMICAL VAPOR DEPOSITION, SILICON-CONTAINING INSULATING FILM AND PROCESS FOR PRODUCTION THEREOF JSR Corporation (JP) 2010-12-22 EP disclosed