SCHEMBL93125

SCHEMBL93125

[CH]1CCCC[CH]CCCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1207 1.00
SCHEMBL816182 0.94
Water SCHEMBL11402627 0.94
Hydrochloric Acid SCHEMBL11547642 0.94
SCHEMBL4647537 0.94
SCHEMBL22635672 0.94
SCHEMBL22234105 0.94
SCHEMBL22043033 0.94
SCHEMBL20873645 0.94
SCHEMBL6519428 0.94

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 52 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4372026-A2 POLYMERIC BINDER AND ALL-SOLID-STATE SECONDARY BATTERY Teijin Limited (JP) 2024-05-22 EP disclosed
CN-113527101-B Novel compound, polymer, process for producing the same, photosensitive resin composition, pattern forming process, cured film, and electronic component 信越化学工业株式会社 2024-04-23 CN disclosed
EP-3896114-B1 POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2023-10-18 EP disclosed
US-11572442-B2 Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2023-02-07 US disclosed
EP-3720835-B1 METHOD FOR PREPARING ETHERS OF CYCLOALIPHATIC OR ARALIPHATIC DIOLS BASF SE (DE) 2022-07-13 EP disclosed
US-20220181632-A1 POLYMERIC BINDER AND ALL-SOLID-STATE SECONDARY BATTERY TEIJIN LIMITED (JP) 2022-06-09 US disclosed
US-20220166026-A1 POLYMERIC BINDER AND ALL-SOLID-STATE SECONDARY BATTERY INCLUDING SAME TEIJIN LIMITED (JP) 2022-05-26 US disclosed
EP-3950769-A1 POLYMERIC BINDER AND ALL-SOLID-STATE SECONDARY BATTERY INCLUDING SAME Teijin Limited (JP) 2022-02-09 EP disclosed
EP-3950770-A1 POLYMERIC BINDER AND ALL-SOLID-STATE SECONDARY BATTERY Teijin Limited (JP) 2022-02-09 EP disclosed
CN-113614146-A Polymer binder and all-solid-state secondary battery comprising same 帝人株式会社 2021-11-05 CN disclosed
EP-1481973-A1 HETEROCYCLE-BEARING ONIUM SALTS Wako Pure Chemical Industries, Ltd. (JP) 2004-12-01 EP disclosed
EP-1443042-A1 HYBRID ONIUM SALT Wako Pure Chemical Industries, Ltd. (JP) 2004-08-04 EP disclosed
US-5002698-A Anti-Wear Agents, Extreme Pressure Additives CIBA-GEIGY CORPORATION (US) 1991-03-26 US disclosed
EP-0233140-B1 LUBRICANT ADDITIVES CONTAINING SULPHUR AND NITROGEN CIBA-GEIGY AG (CH) 1989-11-08 EP disclosed
US-4863621-A WEAR RESISTANCE, EXTREME PRESSURE LUBRICANTS CIBA-GEIGY CORPORATION (US) 1989-09-05 US disclosed
EP-0233140-A1 Lubricant additives containing sulphur and nitrogen CIBA-GEIGY AG (CH) 1987-08-19 EP disclosed
US-4163022-A ANTIPLAQUE AGENTS COOPER LABORATORIES, INC. (US) 1979-07-31 US disclosed
US-4115448-A Carbamylguanidine antimicrobial compounds COOPER LABORATORIES, INC. (US) 1978-09-19 US disclosed
US-4115447-A Carbamylguanidine antimicrobial compounds COOPER LABORATORIES, INC. (US) 1978-09-19 US disclosed
US-4022962-A DENTAL PLAQUE INHIBITORS COOPER LABORATORIES, INC. (US) 1977-05-10 US disclosed