⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Thianthrene SCHEMBL7786 | 0.96 | BCHE (0.56) | — | |
| Thianthrene SCHEMBL29392368 | 0.96 | BCHE (0.56) | — | |
| SCHEMBL21629348 | 0.96 | BCHE (0.56) | — | |
| SCHEMBL25643861 | 0.96 | BCHE (0.56) | — | |
| SCHEMBL30823 | 0.96 | — | — | |
| Thianthrene SCHEMBL14247824 | 0.92 | BCHE (0.53) | — | |
| Fluoride SCHEMBL8845016 | 0.92 | — | — | |
| Ammonia Solution, Strong SCHEMBL29077438 | 0.92 | — | — | |
| Thianthrene SCHEMBL8071394 | 0.92 | BCHE (0.53) | — | |
| Water SCHEMBL28496012 | 0.92 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114106558-A | Extrusion-calendered polyphenylene sulfide copper clad plate material and preparation method thereof | 上海材料研究所 | 2022-03-01 | — | — | CN | claimed |
| CN-114106558-A | Extrusion-calendered polyphenylene sulfide copper clad plate material and preparation method thereof | 上海材料研究所 | 2022-03-01 | — | — | CN | disclosed |
| CN-114106558-A | Extrusion-calendered polyphenylene sulfide copper clad plate material and preparation method thereof | 上海材料研究所 | 2022-03-01 | — | — | CN | disclosed |
| CN-114106558-A | Extrusion-calendered polyphenylene sulfide copper clad plate material and preparation method thereof | 上海材料研究所 | 2022-03-01 | — | — | CN | disclosed |
| EP-0458471-B1 | Low leaching UV curable sealant and encapsulant with post cure mechanism | DOW CORNING (US) | 1994-03-30 | — | — | EP | disclosed |
| US-5147726-A | Vacuum deposition of aluminum on plastic substrate; corrosion resistance, waterproofing | TORAY INDUSTRIES, INC. (JP) | 1992-09-15 | — | — | US | disclosed |
| EP-0458471-A2 | Low leaching UV curable sealant and encapsulant with post cure mechanism | DOW CORNING CORPORATION (US) | 1991-11-27 | — | — | EP | disclosed |