Fluoride Ion

Fluoride Ion

SCHEMBL9329663

CCCC[n+]1cn(C)c2ccccc21.[F-]

nearest known ligand 0.42

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Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PTPN1 P18031 1/20 0.42
NPC1 O15118 6/20 0.41
MEN1 O00255 5/20 0.41
KMT2A Q03164 5/20 0.41
KDM4E B2RXH2 5/20 0.41
HTT P42858 5/20 0.41
RAB9A P51151 5/20 0.41
SMN1; SMN2 Q16637 5/20 0.41
NPSR1 Q6W5P4 4/20 0.41
RAD52 P43351 3/20 0.41
LMNA P02545 2/20 0.41
MAPK1 P28482 2/20 0.41
RGS12 O14924 1/20 0.41
USP2 O75604 1/20 0.41
HSP90AA1 P07900 1/20 0.41
THRB P10828 1/20 0.41
MCL1 Q07820 1/20 0.41
ATM Q13315 1/20 0.40
APAF1 O14727 2/20 0.39
ALDH1A1 P00352 5/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3698833 0.98 PTPN1 (0.43) PTPN1NPC1MEN1KMT2AKDM4E
Bromide SCHEMBL5143677 0.97 PTPN1 (0.42) PTPN1NPC1MEN1KMT2AKDM4E
SCHEMBL21049542 0.92 KDM4E (0.50) PTPN1NPC1MEN1KMT2AKDM4E
SCHEMBL17317384 0.92 KDM4E (0.50) PTPN1NPC1MEN1KMT2AKDM4E
SCHEMBL21049556 0.92 KDM4E (0.50) PTPN1NPC1MEN1KMT2AKDM4E
SCHEMBL21049615 0.92 KDM4E (0.50) PTPN1NPC1MEN1KMT2AKDM4E
Bromide SCHEMBL5143840 0.90 NPSR1 (0.49) NPC1MEN1KMT2AKDM4EHTT
Bromide SCHEMBL17317392 0.90 NPSR1 (0.49) NPC1MEN1KMT2AKDM4EHTT
SCHEMBL3693226 0.90 BCHE (0.41) BCHEACHE
Bicarbonate SCHEMBL31529726 0.88 KDM4E (0.37) PTPN1NPC1MEN1KMT2AKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0398358-B1 Aluminum electroplating method MITSUBISHI PETROCHEMICAL CO (JP) 1994-03-09 EP claimed
US-5041194-A Using low melting mixture of aluminum halide and onium halide of nitrogen-containing compound MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1991-08-20 US claimed
EP-0398358-B1 Aluminum electroplating method MITSUBISHI PETROCHEMICAL CO (JP) 1994-03-09 EP disclosed
US-5041194-A Using low melting mixture of aluminum halide and onium halide of nitrogen-containing compound MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1991-08-20 US disclosed
EP-0398358-A2 Aluminum electroplating method MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1990-11-22 EP disclosed