SCHEMBL940170

SCHEMBL940170

OCCN(CCO)CCCCN(CCO)CCO

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 3/20 0.39
SMN1; SMN2 Q16637 2/20 0.36
KDM4E B2RXH2 1/20 0.36
ALOX15 P16050 1/20 0.36
MAPK1 P28482 2/20 0.33
CYP1A2 P05177 1/20 0.33
CYP2C9 P11712 1/20 0.33
HPGD P15428 1/20 0.33
HIF1A Q16665 1/20 0.33
HSD17B10 Q99714 1/20 0.33
TSHR P16473 1/20 0.33
CA12 O43570 1/20 0.32
CA1 P00915 1/20 0.32
CA2 P00918 1/20 0.32
CA9 Q16790 1/20 0.32
MEN1 O00255 1/20 0.32
ALDH1A1 P00352 1/20 0.32
EGFR P00533 1/20 0.32
LMNA P02545 1/20 0.32
POLB P06746 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18426206 0.96 MAPT (0.37) MAPTSMN1; SMN2KDM4EALOX15MAPK1
SCHEMBL973714 0.96 MAPT (0.37) MAPTSMN1; SMN2KDM4EALOX15MAPK1
SCHEMBL14739930 0.96 MAPT (0.37) MAPTSMN1; SMN2KDM4EALOX15MAPK1
SCHEMBL14739368 0.96 MAPT (0.37) MAPTSMN1; SMN2KDM4EALOX15MAPK1
SCHEMBL14739314 0.96 MAPT (0.37) MAPTSMN1; SMN2KDM4EALOX15MAPK1
SCHEMBL30799718 0.96 MAPT (0.37) MAPTSMN1; SMN2KDM4EALOX15MAPK1
SCHEMBL14739158 0.96 MAPT (0.37) MAPTSMN1; SMN2KDM4EALOX15MAPK1
SCHEMBL14738958 0.96 MAPT (0.37) MAPTSMN1; SMN2KDM4EALOX15MAPK1
SCHEMBL14739160 0.96 MAPT (0.37) MAPTSMN1; SMN2KDM4EALOX15MAPK1
SCHEMBL8219045 0.93 TSHR (0.37) MAPTSMN1; SMN2KDM4EALOX15MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4572882-A1 PROCESS FOR PRODUCING MICROPARTICLES BASF SE (DE) 2025-06-25 EP disclosed
US-11913131-B2 Ternary zinc-nickel-iron alloys and alkaline electrolytes or plating such alloys MACDERMID, INCORPORATED (US) 2024-02-27 US disclosed
WO-2024038046-A1 PROCESS FOR PRODUCING MICROPARTICLES BASF SE (DE) 2024-02-22 WO disclosed
US-20200071843-A1 TERNARY ZINC-NICKEL-IRON ALLOYS AND ALKALINE ELECTROLYTES OR PLATING SUCH ALLOYS MACDERMID, INCORPORATED 2020-03-05 US disclosed
EP-3464684-A1 TERNARY ZINC-NICKEL-IRON ALLOYS AND ALKALINE ELECTROLYTES FOR PLATING SUCH ALLOYS Coventya Inc. (US) 2019-04-10 EP disclosed
US-10087279-B2 Polyol Composition NIPPON SODA CO., LTD. (JP) 2018-10-02 US disclosed
EP-1718786-B1 BATHS, SYSTEMS AND PROCESSES FOR ELECTROPLATING ZINC-NICKEL TERNARY AND HIGHER ALLOYS AND ARTICLES SO ELECTROPLATED ATOTECH DEUTSCHLAND GMBH (DE) 2016-11-30 EP disclosed
US-20160264713-A1 POLYOL COMPOSITION NIPPON SODA CO., LTD. (JP) 2016-09-15 US disclosed
EP-3061781-A1 POLYOL COMPOSITION Nippon Soda Co., Ltd. (JP) 2016-08-31 EP disclosed
US-8481652-B2 Thermoplastic polyamides having polyether amines BASF SE (DE) 2013-07-09 US disclosed
US-20060201820-A1 Aqueous zinc-nickel electroplating alkaline bath, comprising water zinc compound, nickel compound, complexing agent and polyoxyalkylene nonionic surfactant; alloying; smoothness, ductility OPASKAR VINCENT C 2006-09-14 US disclosed
EP-1201789-B1 Plating bath and method for electroplating tin-zinc alloys ATOTECH DEUTSCHLAND GMBH (DE) 2006-06-07 EP disclosed
WO-2005093133-A1 BATHS, SYSTEMS AND PROCESSES FOR ELECTROPLATING ZINC-NICKEL TERNARY AND HIGHER ALLOYS AND ARTICLES SO ELECTROPLATED ATOTECH DEUTSCHLAND GMBH (DE) 2005-10-06 WO disclosed
US-20050189231-A1 Articles with electroplated zinc-nickel ternary and higher alloys, electroplating baths, processes and systems for electroplating such alloys ATOTECH USA, LLC 2005-09-01 US disclosed
US-20050133376-A1 Alkaline zinc-nickel alloy plating compositions, processes and articles therefrom ATOTECH USA, LLC 2005-06-23 US disclosed
US-6436269-B1 COMPRISING SOLUBLE METAL COMPOUNDS AND A CATIONIC POLYMER USED FOR ELECTRODEPOSITION OF METALS HAVING BRIGHT, UNIFORM COATINGS AND A WIDE CURRENT DENSITY RANGE; SOLDERS ATOTECH DEUTSCHLAND GMBH (DE) 2002-08-20 US disclosed
EP-1201789-A2 Plating bath and method for electroplating tin-zinc alloys ATOTECH Deutschland GmbH (DE) 2002-05-02 EP disclosed
EP-0649918-B1 Alkaline zinc-nickel alloy plating baths ROHCO INC MCGEAN (US) 1996-11-20 EP disclosed
US-5417840-A Quaternary ammonium compound containing nitrogen heterocycle, brightness MCGEAN-ROHCO, INC. (US) 1995-05-23 US disclosed
EP-0649918-A1 Alkaline zinc-nickel alloy plating baths MCGEAN-ROHCO, INC. (US) 1995-04-26 EP disclosed