SCHEMBL9404078

SCHEMBL9404078

N=Nc1cccc2[nH]cnc12

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ PARP1 P09874 5/20 0.46
▸ DRD4 P21917 3/20 0.40
▸ DRD3 P35462 3/20 0.40
▸ BRD4 O60885 2/20 0.39
▸ DRD2 P14416 2/20 0.36
▸ MEN1 O00255 2/20 0.36
▸ KMT2A Q03164 2/20 0.36
▸ ALDH1A1 P00352 1/20 0.36
▸ PRNP P04156 1/20 0.36
▸ MAPT P10636 1/20 0.36
▸ HPGD P15428 1/20 0.36
▸ HTT P42858 1/20 0.36
▸ SMN1; SMN2 Q16637 1/20 0.36
▸ LMNA P02545 2/20 0.35
▸ DPP4 P27487 1/20 0.35
▸ POLB P06746 1/20 0.34
▸ AURKA O14965 1/20 0.33
▸ DAPK3 O43293 1/20 0.33
▸ JAK2 O60674 1/20 0.33
▸ PRKD3 O94806 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17591301 0.81 PARP1 (0.50) PARP1DRD4DRD3BRD4DRD2
SCHEMBL24773413 0.74 PARP1 (0.44) PARP1DRD4DRD3BRD4MEN1
SCHEMBL20878376 0.73 BRD4 (0.56) PARP1DRD4DRD3BRD4DRD2
SCHEMBL3171067 0.71 PARP1 (0.52) PARP1DRD4DRD3BRD4DRD2
SCHEMBL22182747 0.71 PARP1 (0.51) PARP1DRD4DRD3BRD4DRD2
SCHEMBL312427 0.69 PARP1 (0.56) PARP1DRD4DRD3BRD4DRD2
SCHEMBL3157571 0.69 PARP1 (0.50) PARP1DRD4DRD3BRD4DRD2
SCHEMBL196738 0.69 PARP1 (0.56) PARP1DRD4DRD3BRD4DRD2
SCHEMBL1261706 0.69 PARP1 (0.55) PARP1DRD4DRD3BRD4DRD2
SCHEMBL900151 0.69 MEN1 (0.52) PARP1DRD4DRD3BRD4DRD2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-6192851-A — — None — — JP disclosed
CN-1989573-A Conductive fine particle, method for producing conductive fine particle and electroless silver plating liquid SEKISUI CHEMICAL CO LTD (JP) 2007-06-27 — — CN disclosed
JP-H06192851-A SURFACE-TREATING AGENT OF COPPER AND COPPER ALLOY SHIKOKU CHEM CORP 1994-07-12 — — JP disclosed
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