Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA12 | O43570 | 3/20 | 0.79 |
| ▸ | CA2 | P00918 | 3/20 | 0.79 |
| ▸ | CA9 | Q16790 | 3/20 | 0.79 |
| ▸ | CA14 | Q9ULX7 | 3/20 | 0.79 |
| ▸ | CA1 | P00915 | 2/20 | 0.79 |
| ▸ | CA3 | P07451 | 2/20 | 0.79 |
| ▸ | CA4 | P22748 | 2/20 | 0.79 |
| ▸ | GLA | P06280 | 1/20 | 0.79 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.79 |
| ▸ | BCL2L1 | Q07817 | 2/20 | 0.53 |
| ▸ | MMP3 | P08254 | 1/20 | 0.53 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.48 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.48 |
| ▸ | HPGD | P15428 | 2/20 | 0.48 |
| ▸ | MEN1 | O00255 | 5/20 | 0.47 |
| ▸ | KMT2A | Q03164 | 5/20 | 0.47 |
| ▸ | NPC1 | O15118 | 3/20 | 0.47 |
| ▸ | LMNA | P02545 | 3/20 | 0.47 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.47 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.47 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Phenol SCHEMBL16632716 | 0.91 | TDP1 (0.65) | CA12CA2CA9CA14CA1 | |
| Phenol SCHEMBL11017636 | 0.89 | — | — | |
| Hydroquinone SCHEMBL28469907 | 0.89 | MEN1 (0.61) | CA12CA2CA9CA14CA1 | |
| Phenol SCHEMBL11067860 | 0.89 | CA12 (1.00) | CA12CA2CA9CA14CA1 | |
| Phenol SCHEMBL14134295 | 0.89 | — | — | |
| Phenol SCHEMBL7750141 | 0.89 | CA12 (1.00) | CA12CA2CA9CA14CA1 | |
| Phenol SCHEMBL9774120 | 0.89 | CA12 (1.00) | CA12CA2CA9CA14CA1 | |
| Phenol SCHEMBL524026 | 0.89 | CA12 (1.00) | CA12CA2CA9CA14CA1 | |
| Phenol SCHEMBL28575 | 0.89 | CA12 (1.00) | CA12CA2CA9CA14CA1 | |
| Phenol SCHEMBL9470299 | 0.89 | CA12 (1.00) | CA12CA2CA9CA14CA1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 230 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2023157833-A1 | INDUCTOR AND METHOD FOR MANUFACTURING SAME | 日東電工株式会社 | 2023-08-24 | — | — | WO | claimed |
| CN-115725052-A | Preparation method of phenol-biphenylene type epoxy resin | 中国石油化工股份有限公司 | 2023-03-03 | — | — | CN | claimed |
| CN-115536813-A | Preparation method of phenol-biphenylene epoxy resin with high epoxy value | 江苏扬农锦湖化工有限公司 | 2022-12-30 | — | — | CN | claimed |
| EP-3229243-B1 | SOFT MAGNETIC RESIN COMPOSITION AND SOFT MAGNETIC FILM | NITTO DENKO CORP (JP) | 2020-09-09 | — | — | EP | claimed |
| US-10636553-B2 | Soft magnetic resin composition and soft magnetic film | NITTO DENKO CORPORATION (JP) | 2020-04-28 | — | — | US | claimed |
| CN-106496935-B | A kind of halogen-free flameproof superelevation CTI high voltage resin combination for copper-clad plate | 无锡宏仁电子材料科技有限公司 | 2019-01-29 | — | — | CN | claimed |
| EP-3229243-A1 | SOFT MAGNETIC RESIN COMPOSITION AND SOFT MAGNETIC FILM | Nitto Denko Corporation (JP) | 2017-10-11 | — | — | EP | claimed |
| US-20170271062-A1 | SOFT MAGNETIC RESIN COMPOSITION AND SOFT MAGNETIC FILM | NITTO DENKO CORPORATION (JP) | 2017-09-21 | — | — | US | claimed |
| CN-107141724-A | It is a kind of for the Halogen of automobile copper-clad plate, resistance to CAF, high Tg, high heat resistant resin composition | 无锡宏仁电子材料科技有限公司 | 2017-09-08 | — | — | CN | claimed |
| CN-107004482-A | Soft magnetism resin combination and soft magnetic film | 日东电工株式会社 | 2017-08-01 | — | — | CN | claimed |
| CN-100487571-C | Negative photosensitive resin composition containing expoxy compound | SHIPLEY CO LTD (US) | 2009-05-13 | — | — | CN | claimed |
| US-7504191-B2 | Photosensitive resin composition and method for the formation of a resin pattern using the composition | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2009-03-17 | — | — | US | claimed |
| US-20080262139-A1 | Flame retardant crosslink agent and epoxy resin compositions free of halogen and phosphorous | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE | 2008-10-23 | — | — | US | claimed |
| US-7195855-B2 | Negative-type photosensitive resin composition containing epoxy compound | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2007-03-27 | — | — | US | claimed |
| US-7195858-B2 | Negative type photosensitive resin composition containing a phenol-biphenylene resin | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2007-03-27 | — | — | US | claimed |
| CN-1550895-A | Negative type photosensitive resin composition containing a phenol-biphenylene resin | ��ķ��˹���Ӳ����������ι�˾ | 2004-12-01 | — | — | CN | claimed |
| US-20040224253-A1 | Negative-type photosensitive resin composition containing epoxy compound | SHIPLEY COMPANY, L.L.C. | 2004-11-11 | — | — | US | claimed |
| US-20040224252-A1 | Photosensitive resin composition and method for the formation of a resin pattern using the composition | SHIPLEY COMPANY, L.L.C. (US) | 2004-11-11 | — | — | US | claimed |
| US-20040219451-A1 | Negative type photosensitive resin composition containing a phenol-biphenylene resin | ROHM AND HAAS ELECTRONIC MATERIALS, L.L.C. | 2004-11-04 | — | — | US | claimed |
| CN-1540444-A | Negative photosensitive resin composition contg, expoxy compound | ϣ | 2004-10-27 | — | — | CN | claimed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20080262139-A1 | Flame retardant crosslink agent and epoxy resin compositions free of halogen and phosphorous | RPL4, RFC4, PRPF4 | CA12 2325/4885CA2 2355/4885CA9 2966/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.