Phenol

Phenol

SCHEMBL94306

Oc1ccccc1.c1ccc2c(c1)-c1ccccc1-2

nearest known ligand 0.79

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA12 O43570 3/20 0.79
CA2 P00918 3/20 0.79
CA9 Q16790 3/20 0.79
CA14 Q9ULX7 3/20 0.79
CA1 P00915 2/20 0.79
CA3 P07451 2/20 0.79
CA4 P22748 2/20 0.79
GLA P06280 1/20 0.79
TDP1 Q9NUW8 1/20 0.79
BCL2L1 Q07817 2/20 0.53
MMP3 P08254 1/20 0.53
ALDH1A1 P00352 3/20 0.48
HSD17B10 Q99714 3/20 0.48
HPGD P15428 2/20 0.48
MEN1 O00255 5/20 0.47
KMT2A Q03164 5/20 0.47
NPC1 O15118 3/20 0.47
LMNA P02545 3/20 0.47
KDM4E B2RXH2 3/20 0.47
CYP3A4 P08684 2/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Phenol SCHEMBL16632716 0.91 TDP1 (0.65) CA12CA2CA9CA14CA1
Phenol SCHEMBL11017636 0.89
Hydroquinone SCHEMBL28469907 0.89 MEN1 (0.61) CA12CA2CA9CA14CA1
Phenol SCHEMBL11067860 0.89 CA12 (1.00) CA12CA2CA9CA14CA1
Phenol SCHEMBL14134295 0.89
Phenol SCHEMBL7750141 0.89 CA12 (1.00) CA12CA2CA9CA14CA1
Phenol SCHEMBL9774120 0.89 CA12 (1.00) CA12CA2CA9CA14CA1
Phenol SCHEMBL524026 0.89 CA12 (1.00) CA12CA2CA9CA14CA1
Phenol SCHEMBL28575 0.89 CA12 (1.00) CA12CA2CA9CA14CA1
Phenol SCHEMBL9470299 0.89 CA12 (1.00) CA12CA2CA9CA14CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 230 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023157833-A1 INDUCTOR AND METHOD FOR MANUFACTURING SAME 日東電工株式会社 2023-08-24 WO claimed
CN-115725052-A Preparation method of phenol-biphenylene type epoxy resin 中国石油化工股份有限公司 2023-03-03 CN claimed
CN-115536813-A Preparation method of phenol-biphenylene epoxy resin with high epoxy value 江苏扬农锦湖化工有限公司 2022-12-30 CN claimed
EP-3229243-B1 SOFT MAGNETIC RESIN COMPOSITION AND SOFT MAGNETIC FILM NITTO DENKO CORP (JP) 2020-09-09 EP claimed
US-10636553-B2 Soft magnetic resin composition and soft magnetic film NITTO DENKO CORPORATION (JP) 2020-04-28 US claimed
CN-106496935-B A kind of halogen-free flameproof superelevation CTI high voltage resin combination for copper-clad plate 无锡宏仁电子材料科技有限公司 2019-01-29 CN claimed
EP-3229243-A1 SOFT MAGNETIC RESIN COMPOSITION AND SOFT MAGNETIC FILM Nitto Denko Corporation (JP) 2017-10-11 EP claimed
US-20170271062-A1 SOFT MAGNETIC RESIN COMPOSITION AND SOFT MAGNETIC FILM NITTO DENKO CORPORATION (JP) 2017-09-21 US claimed
CN-107141724-A It is a kind of for the Halogen of automobile copper-clad plate, resistance to CAF, high Tg, high heat resistant resin composition 无锡宏仁电子材料科技有限公司 2017-09-08 CN claimed
CN-107004482-A Soft magnetism resin combination and soft magnetic film 日东电工株式会社 2017-08-01 CN claimed
CN-100487571-C Negative photosensitive resin composition containing expoxy compound SHIPLEY CO LTD (US) 2009-05-13 CN claimed
US-7504191-B2 Photosensitive resin composition and method for the formation of a resin pattern using the composition ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2009-03-17 US claimed
US-20080262139-A1 Flame retardant crosslink agent and epoxy resin compositions free of halogen and phosphorous INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 2008-10-23 US claimed
US-7195855-B2 Negative-type photosensitive resin composition containing epoxy compound ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2007-03-27 US claimed
US-7195858-B2 Negative type photosensitive resin composition containing a phenol-biphenylene resin ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2007-03-27 US claimed
CN-1550895-A Negative type photosensitive resin composition containing a phenol-biphenylene resin ��ķ�͹�˹���Ӳ����������ι�˾ 2004-12-01 CN claimed
US-20040224253-A1 Negative-type photosensitive resin composition containing epoxy compound SHIPLEY COMPANY, L.L.C. 2004-11-11 US claimed
US-20040224252-A1 Photosensitive resin composition and method for the formation of a resin pattern using the composition SHIPLEY COMPANY, L.L.C. (US) 2004-11-11 US claimed
US-20040219451-A1 Negative type photosensitive resin composition containing a phenol-biphenylene resin ROHM AND HAAS ELECTRONIC MATERIALS, L.L.C. 2004-11-04 US claimed
CN-1540444-A Negative photosensitive resin composition contg, expoxy compound ϣ 2004-10-27 CN claimed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20080262139-A1 Flame retardant crosslink agent and epoxy resin compositions free of halogen and phosphorous RPL4, RFC4, PRPF4 CA12 2325/4885CA2 2355/4885CA9 2966/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.