Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.72 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.72 |
| ▸ | GAA | P10253 | 2/20 | 0.72 |
| ▸ | HPGD | P15428 | 2/20 | 0.72 |
| ▸ | TLR8 | Q9NR97 | 9/20 | 0.66 |
| ▸ | TSHR | P16473 | 2/20 | 0.54 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.54 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.54 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.54 |
| ▸ | LMNA | P02545 | 1/20 | 0.54 |
| ▸ | ATM | Q13315 | 1/20 | 0.51 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.51 |
| ▸ | USP2 | O75604 | 1/20 | 0.51 |
| ▸ | GLA | P06280 | 1/20 | 0.51 |
| ▸ | MAPT | P10636 | 1/20 | 0.51 |
| ▸ | CASP1 | P29466 | 1/20 | 0.51 |
| ▸ | CASP7 | P55210 | 1/20 | 0.51 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.48 |
| ▸ | TLR7 | Q9NYK1 | 1/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9433522 | 1.00 | KDM4E (0.72) | KDM4EALDH1A1GAAHPGDTLR8 | |
| SCHEMBL2537670 | 1.00 | KDM4E (0.72) | KDM4EALDH1A1GAAHPGDTLR8 | |
| SCHEMBL5321847 | 1.00 | KDM4E (0.72) | KDM4EALDH1A1GAAHPGDTLR8 | |
| SCHEMBL9434493 | 1.00 | KDM4E (0.72) | KDM4EALDH1A1GAAHPGDTLR8 | |
| SCHEMBL5319761 | 1.00 | KDM4E (0.72) | KDM4EALDH1A1GAAHPGDTLR8 | |
| SCHEMBL5318249 | 1.00 | KDM4E (0.72) | KDM4EALDH1A1GAAHPGDTLR8 | |
| SCHEMBL5325559 | 1.00 | KDM4E (0.72) | KDM4EALDH1A1GAAHPGDTLR8 | |
| SCHEMBL5318248 | 1.00 | KDM4E (0.72) | KDM4EALDH1A1GAAHPGDTLR8 | |
| SCHEMBL21633651 | 1.00 | KDM4E (0.72) | KDM4EALDH1A1GAAHPGDTLR8 | |
| SCHEMBL5318530 | 1.00 | KDM4E (0.72) | KDM4EALDH1A1GAAHPGDTLR8 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4388020-A1 | POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING WIRING PATTERN | Resonac Corporation (JP) | 2024-06-26 | — | — | EP | disclosed |
| CN-118131567-A | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board | 株式会社力森诺科 | 2024-06-04 | — | — | CN | disclosed |
| CN-118043365-A | Polymer, photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for forming wiring pattern | 株式会社力森诺科 | 2024-05-14 | — | — | CN | disclosed |
| CN-113412289-B | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board | 株式会社力森诺科 | 2024-04-05 | — | — | CN | disclosed |
| CN-117099044-A | Photosensitive resin film, method for forming resist pattern, and method for forming wiring pattern | 株式会社力森诺科 | 2023-11-21 | — | — | CN | disclosed |
| CN-117083568-A | Photosensitive element and method for manufacturing photosensitive element | 株式会社力森诺科 | 2023-11-17 | — | — | CN | disclosed |
| WO-2023127934-A1 | ENERGY-RAY-CURABLE COMPOSITION FOR THREE-DIMENSIONAL SHAPING USE, DENTAL STRUCTURE, MOUTHPIECE, TEETH-STRAIGHTENING MOUTHPIECE, AND METHOD FOR PRODUCING DENTAL STRUCTURE | クラレノリタケデンタル株式会社 | 2023-07-06 | — | — | WO | disclosed |
| CN-116209955-A | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board | 株式会社力森诺科 | 2023-06-02 | — | — | CN | disclosed |
| CN-116209571-A | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board | 株式会社力森诺科 | 2023-06-02 | — | — | CN | disclosed |
| WO-2023050062-A1 | POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING WIRING PATTERN | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2023-04-06 | — | — | WO | disclosed |
| CN-114222766-A | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board | 昭和电工材料株式会社 | 2022-03-22 | — | — | CN | disclosed |
| CN-108419438-B | Coloring composition | 株式会社艾迪科 | 2021-10-01 | — | — | CN | disclosed |
| CN-113412289-A | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board | 昭和电工材料株式会社 | 2021-09-17 | — | — | CN | disclosed |
| WO-2021132699-A1 | ENERGY RAY-CURABLE COATING MATERIAL FOR THREE-DIMENSIONAL MOLDING, ENERGY RAY-CURABLE MATERIAL KIT FOR THREE-DIMENSIONAL MOLDING CONTAINING SAID SAME, THREE-DIMENSIONAL MOLDED PRODUCT OBTAINED USING SAME, AND METHOD FOR PRODUCING SAME | クラレノリタケデンタル株式会社 | 2021-07-01 | — | — | WO | disclosed |
| WO-2021029039-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | 昭和電工マテリアルズ株式会社 | 2021-02-18 | — | — | WO | disclosed |
| CN-112154167-A | Composition, cured product, optical filter, and method for producing cured product | 株式会社艾迪科 | 2020-12-29 | — | — | CN | disclosed |
| CN-111566173-A | Coating composition, method for curing the composition, barrier film, and method for producing cured product | 株式会社艾迪科 | 2020-08-21 | — | — | CN | disclosed |
| WO-2020021969-A1 | COMPOSITION, CURED PRODUCT, OPTICAL FILTER, AND PRODUCTION METHOD FOR CURED PRODUCT | 株式会社ADEKA | 2020-01-30 | — | — | WO | disclosed |
| CN-102037406-A | Photosensitive resin composition, photosensitive element, method for producing resist pattern, and method for producing printed wiring board | HITACHI CHEMICAL CO LTD | 2011-04-27 | — | — | CN | disclosed |
| US-5334484-A | Using an acridine compound as photoinitiator | HITACHI CHEMICAL CO., LTD. (JP) | 1994-08-02 | — | — | US | disclosed |