SCHEMBL9475145

SCHEMBL9475145

NC(=O)NC(N)=O.[Cu]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27316452 0.96
SCHEMBL15045 0.95
SCHEMBL27524722 0.95 CRBN (0.60)
SCHEMBL27560286 0.95 CRBN (0.60)
SCHEMBL27939070 0.95 CRBN (0.60)
Water SCHEMBL7642577 0.91
Hydrochloric Acid SCHEMBL5583405 0.91
Ammonia Solution, Strong SCHEMBL9487082 0.91
Ammonia Solution, Strong SCHEMBL15093113 0.91
Urea SCHEMBL4666861 0.91 CRBN (0.56)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-101899664-B Electroplating method BYD CO LTD 2012-06-20 CN claimed
CN-101899664-A Electroplating method BYD CO LTD 2010-12-01 CN claimed
CN-101275255-A Maintenance method for alkaline non-cyanide plating copper GUANGZHOU ERQING INDUSTRY SCIE (CN) 2008-10-01 CN claimed
CN-1183485-A Non-cyanide alkali biuret copper plating method RENMIN ELECTRIC APPLIANCES PLA (CN) 1998-06-03 CN claimed
CN-111356483-A Radioactive antitumor agent 国立研究开发法人量子科学技术研究开发机构 2020-06-30 CN disclosed
CN-102944525-B Preparation method of nickel-biuret kit, its product and application method SHANGHAI EAST HOSPITAL 2015-03-11 CN disclosed
CN-102944525-A Preparation method of nickel-biuret kit, its product and application method SHANGHAI EAST HOSPITAL 2013-02-27 CN disclosed
CN-101899664-B Electroplating method BYD CO LTD 2012-06-20 CN disclosed
CN-101302635-B Steel member acidic electroplating additive for copper pre-plating and pre-plating process GUOZHU LIANG 2010-12-08 CN disclosed
CN-101899664-A Electroplating method BYD CO LTD 2010-12-01 CN disclosed
CN-101302635-A Steel member acidic electroplating additive for copper pre-plating and pre-plating process GUOZHU LIANG (CN) 2008-11-12 CN disclosed
CN-101275255-A Maintenance method for alkaline non-cyanide plating copper GUANGZHOU ERQING INDUSTRY SCIE (CN) 2008-10-01 CN disclosed
CN-1183485-A Non-cyanide alkali biuret copper plating method RENMIN ELECTRIC APPLIANCES PLA (CN) 1998-06-03 CN disclosed
CN-1183485-A Non-cyanide alkali biuret copper plating method RENMIN ELECTRIC APPLIANCES PLA (CN) 1998-06-03 CN disclosed
US-5261876-A Enhanced peritoneal membrane plasmapheresis MONCRIEF-POPOVICH RESEARCH INSTITUTE, INC. (US) 1993-11-16 US disclosed
EP-0077064-B1 PHOTOGRAPHIC ELEMENT COMPRISING A LAYER CONTAINING A CROSS-LINKED POLYMER EASTMAN KODAK COMPANY (a New Jersey corporation) (US) 1985-03-27 EP disclosed
EP-0077064-A1 Photographic element comprising a layer containing a cross-linked polymer EASTMAN KODAK COMPANY (a New Jersey corporation) (US) 1983-04-20 EP disclosed
US-4358524-A Polymeric vehicle for metallizable dye image-receiving layer EASTMAN KODAK COMPANY (US) 1982-11-09 US disclosed
US-4100202-A Oxidative coupling of alkylphenols or 1-naphthols catalyzed by cupric complexes ICI AMERICAS INC. (US) 1978-07-11 US disclosed