Dimethylamine

Dimethylamine

SCHEMBL9505957

B.CNC.N

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Dimethylamine SCHEMBL9936573 0.91
Dimethylamine SCHEMBL34800 0.91
Dimethylamine SCHEMBL22581150 0.91 KDM4E (0.38)
Dimethylamine SCHEMBL292029 0.91
Dimethylamine SCHEMBL10600195 0.91 KDM4E (0.38)
Dimethylamine SCHEMBL5427593 0.83
Dimethylamine SCHEMBL7069656 0.83
Dimethylamine SCHEMBL7992845 0.83
Dimethylamine SCHEMBL29100251 0.83
Dimethylamine SCHEMBL27845552 0.83

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0384180-B1 FORMALDEHYDE-FREE ELECTROLESS COPPER PLATING SOLUTIONS LeaRonal, Inc. (US) 1993-08-11 EP disclosed
EP-0384180-A1 Formaldehyde-free electroless copper plating solutions LeaRonal, Inc. (US) 1990-08-29 EP disclosed