⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11418176 | 1.00 | — | — | |
| Hydrazine SCHEMBL11600083 | 0.94 | — | — | |
| SCHEMBL48575 | 0.93 | — | — | |
| SCHEMBL1682929 | 0.93 | — | — | |
| SCHEMBL28081962 | 0.93 | — | — | |
| Hydrochloric Acid SCHEMBL2225918 | 0.86 | — | — | |
| Hydrochloric Acid SCHEMBL1913494 | 0.86 | — | — | |
| SCHEMBL6435437 | 0.86 | — | — | |
| Ethane SCHEMBL10431270 | 0.86 | — | — | |
| Hydrazine SCHEMBL3175586 | 0.86 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113546660-B | Alloy catalyst and application thereof in efficient hydrogen production of borane derivatives | 南京理工大学 | 2023-10-13 | — | — | CN | claimed |
| CN-113546660-A | Alloy catalyst and application thereof in efficient hydrogen production of borane derivative | 南京理工大学 | 2021-10-26 | — | — | CN | claimed |
| CN-113546660-B | Alloy catalyst and application thereof in efficient hydrogen production of borane derivatives | 南京理工大学 | 2023-10-13 | — | — | CN | disclosed |
| CN-113546660-B | Alloy catalyst and application thereof in efficient hydrogen production of borane derivatives | 南京理工大学 | 2023-10-13 | — | — | CN | disclosed |
| CN-113546660-A | Alloy catalyst and application thereof in efficient hydrogen production of borane derivative | 南京理工大学 | 2021-10-26 | — | — | CN | disclosed |
| EP-0384180-B1 | FORMALDEHYDE-FREE ELECTROLESS COPPER PLATING SOLUTIONS | LeaRonal, Inc. (US) | 1993-08-11 | — | — | EP | disclosed |
| EP-0384180-A1 | Formaldehyde-free electroless copper plating solutions | LeaRonal, Inc. (US) | 1990-08-29 | — | — | EP | disclosed |