SCHEMBL9507540

SCHEMBL9507540

CC(O)OC(=O)c1ccc(O)cc1

nearest known ligand 0.74

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA12 O43570 5/20 0.74
CA1 P00915 5/20 0.74
CA2 P00918 5/20 0.74
CA7 P43166 5/20 0.74
CA9 Q16790 5/20 0.74
CA14 Q9ULX7 5/20 0.74
ALDH1A1 P00352 2/20 0.56
ESR1 P03372 5/20 0.55
ESR2 Q92731 3/20 0.55
ADRB2 P07550 2/20 0.50
ADRB1 P08588 2/20 0.50
ADRB3 P13945 2/20 0.50
TSHR P16473 2/20 0.48
CHRM1 P11229 1/20 0.48
SLC6A2 P23975 1/20 0.48
KDR P35968 1/20 0.48
TDP1 Q9NUW8 1/20 0.48
PDCD1 Q15116 1/20 0.47
CD274 Q9NZQ7 1/20 0.47
MEN1 O00255 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL319947 0.91 CA1 (0.59) CA12CA1CA2CA7CA9
Isopropyl 4-Hydroxybenzoate SCHEMBL34494 0.85 CA12 (1.00) CA12CA1CA2CA7CA9
SCHEMBL902823 0.83 CA1 (0.52) CA12CA1CA2CA7CA9
Isopropyl 4-Hydroxybenzoate SCHEMBL1712159 0.83 CA12 (0.96) CA12CA1CA2CA7CA9
SCHEMBL7615620 0.83 CA1 (0.57) CA12CA1CA2CA7CA9
SCHEMBL25199395 0.82 CA12 (0.71) CA12CA1CA2CA7CA9
SCHEMBL9980893 0.82 CA12 (0.71) CA12CA1CA2CA7CA9
SCHEMBL3024474 0.82 CA12 (0.71) CA12CA1CA2CA7CA9
SCHEMBL11058125 0.82 CA12 (0.71) CA12CA1CA2CA7CA9
SCHEMBL28198900 0.82 CA12 (0.71) CA12CA1CA2CA7CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122037852-A Preparation and application methods of low-residue thermal stripping temporary bonding adhesive 重庆邦锐特新材料有限公司 2026-05-15 CN claimed
CN-122037852-A Preparation and application methods of low-residue thermal stripping temporary bonding adhesive 重庆邦锐特新材料有限公司 2026-05-15 CN disclosed
WO-2021045005-A1 COMPOSITION FOR EXTERNAL APPLICATION ロート製薬株式会社 2021-03-11 WO disclosed
EP-0261976-B1 PROCESS FOR THE PREPARATION OF COPOLYESTERS WHICH SHOW ANISOTROPY WHEN MOLTEN POLYPLASTICS CO. LTD. (JP) 1993-09-08 EP disclosed