SCHEMBL9541224

SCHEMBL9541224

C=C=C[Si](OC)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16175821 0.78
SCHEMBL5192904 0.71
SCHEMBL28844117 0.69
SCHEMBL19195459 0.69
SCHEMBL28111315 0.65
SCHEMBL14783697 0.62
SCHEMBL22614 0.62
SCHEMBL5539643 0.62
SCHEMBL28077167 0.62
SCHEMBL574582 0.60

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-5170828-A None JP disclosed
US-9951291-B2 Producing carbon-based boundary films from catalytically active lubricant additives UCHICAGO ARGONNE, LLC (US) 2018-04-24 US disclosed
US-20160340602-A1 PRODUCING CARBON-BASED BOUNDARY FILMS FROM CATALYTICALLY ACTIVE LUBRICANT ADDITIVES UCHICAGO ARGONNE, LLC (US) 2016-11-24 US disclosed
US-20130052524-A1 ELECTROLYTIC SOLUTION, SECONDARY BATTERY, BATTERY PACK, ELECTRIC VEHICLE, ELECTRIC POWER STORAGE SYSTEM, ELECTRIC POWER TOOL, AND ELECTRONIC DEVICE SONY CORPORATION (JP) 2013-02-28 US disclosed
JP-H05170828-A ETHYLENE COPOLYMER AND RESIN COMPOSITION CONTAINING SAME MITSUBISHI PETROCHEM CO LTD 1993-07-09 JP disclosed