SCHEMBL9605862

SCHEMBL9605862

CCOC(=O)[C@@H]1[C@@H]2CC[C@@H](C2)[C@H]1C(=O)OCC

nearest known ligand 0.52

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
PPM1B O75688 1/20 0.52
PTPN1 P18031 1/20 0.52
PPP1CC P36873 1/20 0.52
ALDH1A1 P00352 5/20 0.46
CYP1A2 P05177 2/20 0.46
CYP2C19 P33261 2/20 0.46
MEN1 O00255 2/20 0.46
KMT2A Q03164 2/20 0.46
CYP2C9 P11712 1/20 0.46
MAPT P10636 2/20 0.42
KCNH2 Q12809 1/20 0.40
TSHR P16473 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10050521 1.00 PPM1B (0.52) PPM1BPTPN1PPP1CCALDH1A1CYP1A2
SCHEMBL14189733 1.00 PPM1B (0.52) PPM1BPTPN1PPP1CCALDH1A1CYP1A2
SCHEMBL14189734 1.00 PPM1B (0.52) PPM1BPTPN1PPP1CCALDH1A1CYP1A2
SCHEMBL8400471 1.00 PPM1B (0.52) PPM1BPTPN1PPP1CCALDH1A1CYP1A2
SCHEMBL19323685 0.92 PPM1B (0.59) PPM1BPTPN1PPP1CCALDH1A1CYP1A2
SCHEMBL19318639 0.92 PPM1B (0.59) PPM1BPTPN1PPP1CCALDH1A1CYP1A2
SCHEMBL11241112 0.92 PPM1B (0.59) PPM1BPTPN1PPP1CCALDH1A1CYP1A2
SCHEMBL14874553 0.91 PPM1B (0.55) PPM1BPTPN1PPP1CCALDH1A1MEN1
SCHEMBL14874442 0.91 PPM1B (0.55) PPM1BPTPN1PPP1CCALDH1A1MEN1
SCHEMBL14189737 0.91 PPM1B (0.55) PPM1BPTPN1PPP1CCALDH1A1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9890244-B2 Thermally decomposable polymer compositions incorporating thermally activated base generators SUMITOMO BAKELITE CO., LTD. (JP) 2018-02-13 US disclosed
US-9765200-B2 Polymer composition for microelectronic assembly PROMERUS, LLC (US) 2017-09-19 US disclosed
US-9765200-B2 Polymer composition for microelectronic assembly PROMERUS, LLC (US) 2017-09-19 US disclosed
US-9757818-B2 Thermally decomposable polymer compositions for forming microelectronic assemblies PROMERUS, LLC (US) 2017-09-12 US disclosed
US-9757818-B2 Thermally decomposable polymer compositions for forming microelectronic assemblies PROMERUS, LLC (US) 2017-09-12 US disclosed
US-20170036308-A1 THERMALLY DECOMPOSABLE POLYMER COMPOSITIONS FOR FORMING MICROELECTRONIC ASSEMBLIES PROMERUS, LLC (US) 2017-02-09 US disclosed
US-20170036308-A1 THERMALLY DECOMPOSABLE POLYMER COMPOSITIONS FOR FORMING MICROELECTRONIC ASSEMBLIES PROMERUS, LLC (US) 2017-02-09 US disclosed
US-9505948-B2 Thermally decomposable polymer compositions for forming microelectronic assemblies PROMERUS, LLC (US) 2016-11-29 US disclosed
US-9505948-B2 Thermally decomposable polymer compositions for forming microelectronic assemblies PROMERUS, LLC (US) 2016-11-29 US disclosed
US-20150337081-A1 THERMALLY DECOMPOSABLE POLYMER COMPOSITIONS INCORPORATING THERMALLY ACTIVATED BASE GENERATORS PROMERUS, LLC (US) 2015-11-26 US disclosed
US-9115300-B2 Thermally decomposable polymer compositions incorporating thermally activated base generators PROMERUS, LLC 2015-08-25 US disclosed
WO-2014099614-A1 THERMALLY DECOMPOSABLE POLYMER COMPOSITION FOR FORMING MICROELECTRIC ASSEMBLIES PROMERUS, LLC (US) 2014-06-26 WO disclosed
US-8729215-B2 Sacrificial polymer compositions including polycarbonates having repeat units derived from stereospecific polycyclic 2,3-diol monomers PROMERUS, LLC (US) 2014-05-20 US disclosed
US-20140024799-A1 Sacrificial Polymer Compositions Including Polycarbonates Having Repeat Units Derived From Stereospecific Polycyclic 2,3-Diol Monomers PROMERUS, LLC (US) 2014-01-23 US disclosed
US-8575297-B2 Sacrificial polymer compositions including polycarbonates having repeat units derived from stereospecific polycyclic 2,3-diol monomers Promerus, LCC (US) 2013-11-05 US disclosed
US-8535454-B2 Polymer composition for microelectronic assembly PROMERUS, LLC (US) 2013-09-17 US disclosed
US-20120318854-A1 THERMALLY DECOMPOSABLE POLYMER COMPOSITIONS INCORPORATING THERMALLY ACTIVATED BASE GENERATORS PROMERUS LLC (US) 2012-12-20 US disclosed
US-20120298729-A1 Polymer Composition for Microelectronic Assembly PROMERUS LLC (US) 2012-11-29 US disclosed
WO-2012071319-A2 POLYMER COMPOSITION FOR MICROELECTRONIC ASSEMBLY PROMERUS LLC (US) 2012-05-31 WO disclosed
US-20120031556-A1 Sacrificial Polymer Compositions Including Polycarbonates Having Repeat Units Derived from Stereospecific Polycyclic 2,3-Diol Monomers PROMERUS LLC (US) 2012-02-09 US disclosed