SCHEMBL9630435

SCHEMBL9630435

COC(OC)(C(=O)c1ccc(O)cc1)c1ccccc1

nearest known ligand 0.80

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CES1 P23141 1/20 0.80
CES2 O00748 1/20 0.46
ESR1 P03372 5/20 0.44
ESR2 Q92731 4/20 0.44
CA12 O43570 2/20 0.44
CA1 P00915 2/20 0.44
CA2 P00918 2/20 0.44
CA7 P43166 2/20 0.44
CA9 Q16790 2/20 0.44
CA14 Q9ULX7 2/20 0.44
ALDH1A1 P00352 2/20 0.44
CYP3A4 P08684 2/20 0.44
SRC P12931 1/20 0.42
LMNA P02545 4/20 0.42
MAPT P10636 2/20 0.42
KCNN4 O15554 1/20 0.42
MEN1 O00255 1/20 0.42
RAB9A P51151 1/20 0.42
KMT2A Q03164 1/20 0.42
ESRRB O95718 2/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Phenol SCHEMBL27461359 0.93 CES1 (0.86) CES1CES2ESR1ESR2CA12
SCHEMBL13268944 0.91 CES1 (0.65) CES1ESR1ESR2CA12CA1
SCHEMBL1679763 0.89 CES1 (1.00) CES1CES2ALDH1A1SRCLMNA
SCHEMBL15173 0.89 CES1 (1.00) CES1CES2ALDH1A1SRCLMNA
SCHEMBL27532278 0.88 CES1 (0.83) CES1ALDH1A1CYP3A4SRCMAPT
Methoxymethane SCHEMBL28719477 0.87 CES1 (0.96) CES1CES2ALDH1A1SRCLMNA
SCHEMBL11495021 0.86 CES1 (0.80) CES1ALDH1A1SRCLMNAMAPT
Formaldehyde SCHEMBL1128921 0.86 CES1 (0.93) CES1CES2ALDH1A1CYP3A4SRC
SCHEMBL28324796 0.86 CES1 (0.93) CES1CES2ALDH1A1CYP3A4SRC
Formaldehyde SCHEMBL28114609 0.86 CES1 (0.93) CES1CES2ALDH1A1CYP3A4SRC

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5098766-A Glass epoxy prepreg, photocured adhesive, epoxy resins, phenolic resins, acrylated epoxy resins IBM CORPORATION (US) 1992-03-24 US claimed
WO-2021140926-A1 ELECTRICALLY CONDUCTIVE ADHESIVE, AND JOINED STRUCTURE AND ELECTRONIC COMPONENT USING SAME 日本化学工業株式会社 2021-07-15 WO disclosed
WO-2021079852-A1 CONDUCTIVE ADHESIVE, AND ADHESIVE STRUCTURE AND ELECTRONIC COMPONENT USING SAME 日本化学工業株式会社 2021-04-29 WO disclosed
WO-2015031927-A1 PHOTOINITIATOR DURST PHOTOTECHNIK DIGITAL TECHNOLOGY GMBH (AT) 2015-03-12 WO disclosed
US-20080241424-A1 Ink-jet ink and ink-jet recording method KONICA MINOLTA HOLDINGS, INC. (JP) 2008-10-02 US disclosed
EP-0110540-B1 CONFORMAL COATING SYSTEMS LOCTITE CORPORATION (US) 1987-05-13 EP disclosed
EP-0110540-A1 Conformal coating systems LOCTITE CORPORATION (US) 1984-06-13 EP disclosed
US-4424252-A Conformal coating systems LOCTITE CORPORATION (US) 1984-01-03 US disclosed