⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9418383 | 1.00 | — | — | |
| SCHEMBL9681825 | 1.00 | — | — | |
| SCHEMBL28418342 | 1.00 | — | — | |
| SCHEMBL6037423 | 1.00 | — | — | |
| SCHEMBL6037401 | 1.00 | — | — | |
| SCHEMBL6037425 | 1.00 | — | — | |
| SCHEMBL9682265 | 1.00 | — | — | |
| SCHEMBL9682286 | 1.00 | — | — | |
| SCHEMBL28425726 | 1.00 | — | — | |
| SCHEMBL6037343 | 1.00 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4159740-B1 | CYCLIC SILAZANE COMPOUND HAVING ALKOXYSILYL GROUP, METHOD FOR PRODUCING SAME, AND COMPOSITION, CURED PRODUCT AND COVERED SUBSTRATE CONTAINING SAME | SHINETSU CHEMICAL CO (JP) | 2025-10-29 | — | — | EP | disclosed |
| US-12319815-B2 | Resin composition, method for producing same, and multi-liquid curable resin composition | KANEKA CORPORATION (JP) | 2025-06-03 | — | — | US | disclosed |
| US-12312494-B2 | Resin composition, method for producing same, and multi-liquid curable resin composition | KANEKA CORPORATION (JP) | 2025-05-27 | — | — | US | disclosed |
| US-12071562-B2 | Cyclic silazane compound having alkoxysilyl group, method for producing same, and composition, cured product and covered substrate containing same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-08-27 | — | — | US | disclosed |
| CN-111825710-B | Alkoxysilyl group-containing organosilane compound, method for producing same, composition containing same, and cured product | 信越化学工业株式会社 | 2024-08-23 | — | — | CN | disclosed |
| CN-115003759-B | Resin composition, method for producing same, and multicomponent curable resin composition | 株式会社钟化 | 2023-12-01 | — | — | CN | disclosed |
| US-11803123-B2 | Photosensitive resin composition having improved adhesiveness or adhesion and light blocking layer using same | DUK SAN NEOLUX CO., LTD. | 2023-10-31 | — | — | US | disclosed |
| US-11803123-B2 | Photosensitive resin composition having improved adhesiveness or adhesion and light blocking layer using same | DUK SAN NEOLUX CO., LTD. | 2023-10-31 | — | — | US | disclosed |
| CN-116917368-A | Curable resin composition and use thereof | 株式会社钟化 | 2023-10-20 | — | — | CN | disclosed |
| US-20230324792-A1 | PHOTOSENSITIVE COMPOSITION FOR FORMING LIGHT BLOCKING LAYER OF ORGANIC LIGHT EMITTING DEVICE | DUK SAN NEOLUX CO., LTD. (KR) | 2023-10-12 | — | — | US | disclosed |
| US-20200241415-A1 | PHOTOSENSITIVE RESIN COMPOSITION HAVING IMPROVED ADHESIVENESS OR ADHESION AND LIGHT BLOCKING LAYER USING SAME | DUK SAN NEOLUX CO., LTD (KR) | 2020-07-30 | — | — | US | disclosed |
| EP-3235845-B1 | PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT AND LAMINATE | KANEKA CORP (JP) | 2020-07-15 | — | — | EP | disclosed |
| CN-111233916-A | Long carbon chain sulfur-containing silane coupling agent, and preparation method and application thereof | 南京曙光精细化工有限公司 | 2020-06-05 | — | — | CN | disclosed |
| CN-111247484-A | Photosensitive resin composition having improved adhesion or adhesiveness and light shielding layer using the same | 德山新勒克斯有限公司 | 2020-06-05 | — | — | CN | disclosed |
| US-20200095370-A1 | CONDUCTIVE PASTE COMPOSITION, DEVICE COMPRISING ELECTRODE FORMED FROM SAME, AND METHOD FOR PRODUCING CONDUCTIVE PASTE COMPOSITION | KANEKA CORPORATION (JP) | 2020-03-26 | — | — | US | disclosed |
| US-10563088-B2 | Photocurable and thermosetting resin composition, cured product, and laminate | KANEKA CORPORATION (JP) | 2020-02-18 | — | — | US | disclosed |
| CN-110651336-A | Conductive paste composition, device including electrode formed from conductive paste composition, and method for producing conductive paste composition | 株式会社钟化 | 2020-01-03 | — | — | CN | disclosed |
| EP-3235845-A1 | PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT AND LAMINATE | Kaneka Corporation (JP) | 2017-10-25 | — | — | EP | disclosed |
| US-20170283649-A1 | PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE | KANEKA CORPORATION (JP) | 2017-10-05 | — | — | US | disclosed |
| EP-0491622-A1 | Novel organosilicon compound | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1992-06-24 | — | — | EP | disclosed |