SCHEMBL9683290

SCHEMBL9683290

CCO[Si](C)(CCCCCCCCS)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28891704 1.00
SCHEMBL31719616 1.00
SCHEMBL28423752 1.00
SCHEMBL9683586 1.00
SCHEMBL9683319 1.00
SCHEMBL9682250 1.00
SCHEMBL15524146 1.00
SCHEMBL9683291 1.00
SCHEMBL611516 0.98
SCHEMBL49408 0.91

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4159740-B1 CYCLIC SILAZANE COMPOUND HAVING ALKOXYSILYL GROUP, METHOD FOR PRODUCING SAME, AND COMPOSITION, CURED PRODUCT AND COVERED SUBSTRATE CONTAINING SAME SHINETSU CHEMICAL CO (JP) 2025-10-29 EP disclosed
US-12319815-B2 Resin composition, method for producing same, and multi-liquid curable resin composition KANEKA CORPORATION (JP) 2025-06-03 US disclosed
US-12312494-B2 Resin composition, method for producing same, and multi-liquid curable resin composition KANEKA CORPORATION (JP) 2025-05-27 US disclosed
US-12071562-B2 Cyclic silazane compound having alkoxysilyl group, method for producing same, and composition, cured product and covered substrate containing same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-08-27 US disclosed
US-20230108908-A1 CYCLIC SILAZANE COMPOUND HAVING ALKOXYSILYL GROUP, METHOD FOR PRODUCING SAME, AND COMPOSITION, CURED PRODUCT AND COVERED SUBSTRATE CONTAINING SAME SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-04-06 US disclosed
EP-4159740-A1 CYCLIC SILAZANE COMPOUND HAVING ALKOXYSILYL GROUP, METHOD FOR PRODUCING SAME, AND COMPOSITION, CURED PRODUCT AND COVERED SUBSTRATE CONTAINING SAME Shin-Etsu Chemical Co., Ltd. (JP) 2023-04-05 EP disclosed
CN-115873030-A Cyclic silazane compound having alkoxysilyl group, process for producing the same, composition containing the same, cured product, and coated substrate 信越化学工业株式会社 2023-03-31 CN disclosed
US-20220340777-A1 RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MULTI-LIQUID CURABLE RESIN COMPOSITION KANEKA CORPORATION (JP) 2022-10-27 US disclosed
US-20220073747-A1 RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MULTI-LIQUID CURABLE RESIN COMPOSITION KANEKA CORPORATION (JP) 2022-03-10 US disclosed
US-11066509-B2 Conductive paste composition, device comprising electrode formed from same, and method for producing conductive paste composition KANEKA CORPORATION (JP) 2021-07-20 US disclosed
EP-3235845-B1 PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT AND LAMINATE KANEKA CORP (JP) 2020-07-15 EP disclosed
CN-111233916-A Long carbon chain sulfur-containing silane coupling agent, and preparation method and application thereof 南京曙光精细化工有限公司 2020-06-05 CN disclosed
US-20200095370-A1 CONDUCTIVE PASTE COMPOSITION, DEVICE COMPRISING ELECTRODE FORMED FROM SAME, AND METHOD FOR PRODUCING CONDUCTIVE PASTE COMPOSITION KANEKA CORPORATION (JP) 2020-03-26 US disclosed
US-10563088-B2 Photocurable and thermosetting resin composition, cured product, and laminate KANEKA CORPORATION (JP) 2020-02-18 US disclosed
US-10323049-B2 Organosilicon compound containing isocyanate group, process for producing same, adhesive, pressure-sensitive adhesive, and coating material SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-06-18 US disclosed
US-20170349614-A1 ORGANOSILICON COMPOUND CONTAINING ISOCYANATE GROUP, PROCESS FOR PRODUCING SAME, ADHESIVE, PRESSURE-SENSITIVE ADHESIVE, AND COATING MATERIAL SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-12-07 US disclosed
EP-3239158-A1 ORGANOSILICON COMPOUND CONTAINING ISOCYANATE GROUP, PROCESS FOR PRODUCING SAME, ADHESIVE, PRESSURE-SENSITIVE ADHESIVE, AND COATING MATERIAL Shin-Etsu Chemical Co., Ltd. (JP) 2017-11-01 EP disclosed
EP-3235845-A1 PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT AND LAMINATE Kaneka Corporation (JP) 2017-10-25 EP disclosed
US-20170283649-A1 PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE KANEKA CORPORATION (JP) 2017-10-05 US disclosed
EP-0491622-A1 Novel organosilicon compound SHIN-ETSU CHEMICAL CO., LTD. (JP) 1992-06-24 EP disclosed